To All,
some news on FCT, KLIC's joint venture with Delco:
Company Press Release
Partnership Formed to Develop Flip Chip Packaging of Integrated
Passive Components
California Micro Devices (NASDAQ NMS:CAMD) forms partnership to develop flip chip
packaging of their patented integrated passive components. (1)
MILPITAS, Calif.--(BUSINESS WIRE)--Feb. 4, 1998-- Three companies will collaborate in a proposed effort to develop
flip chip packaging of integrated passive components (IPC's) and qualify them for use in full scale production.
The ultimate goal of the partnership is to develop low cost, high volume IPC's in flip chip packaging, which can be directly
attached to PC boards without intermediate packaging. California Micro Devices (CMD) formed this partnership to develop
products that will provide improved packaging and assembly techniques for the computer and wireless markets.
Flip Chip Packaging
Today's designers are faced with the challenge of designing systems that continue to shrink in size or include more functionality.
Portable systems are the most sensitive to these space constraints, but the same issues apply to almost all systems. At the same
time, performance and cost pressures continue to increase. IPC's were developed to meet these needs, and flip chip packaging
will provide a further step forward over current semiconductor surface mount packaging.
Flip chip packaging technology allows attachment of the chip, without any intermediate packaging, directly to a substrate.
Designers concerned with reducing cost and size, and increasing the functionality of their products are expected to take
advantage of the enormous benefits of these devices. This packaging will enhance the benefits of IPC's by reducing the
component footprint as much as ten times, increasing performance and reliability, and reducing manufacturing costs.
Packaging Partner
''Increasing performance and decreasing product size. These are the two demands turning designers away from the traditions
of wirebonding and packaged IC's and towards the use of flip chips,'' stated Harry Hollack, President and CEO of Flip Chip
Technologies. In its partnership with CMD, Flip Chip Technologies will provide their proprietary solder bumping processing
capabilities. ''We expect use of flip chip technology to grow an astonishing 38% compounded annually between now and the
year 2001. As a manufacturing resource for CMD, we look forward to providing the computer and wireless industry with the
first IPC's in flip chip packaging,'' Hollack further stated.
Assembly Partner
Avex Electronics Inc.(Avex), a contract manufacturer, and the third participant joining California Micro Devices, is developing
the assembly processes to utilize flip chip techniques. Avex is partnering with CMD to help realize the combined benefit of an
IPC with this smallest available packaging. According to Todd Westerbrook, Vice President for Avex, ''The ability to put
IPC's directly onto a PC board will give us another, very cost effective way to service our customers.''
The Products
Initial developments will utilize a flip chip integrated passive network, containing 16 resistors on a single die in a footprint of only
.120' x .060'. This represents over 90% savings in area compared to the smallest QSOP package. ''Flip chip packaging of
IPC's will also provide height benefits. A flip chip IPC will be less than 0.025 inches in height, compared to a standard QSOP
or SOIC package which measures 0.065. These characteristics make flip chip IPC's ideal for portable devices which require
both a small footprint and lower profile,'' stated Jeff Kalb, President of CMD. He went on to note, ''This also significantly
changes the cost and delivery models for manufacturers. Both manufacturing cycle times and costs are substantially reduced.''
Headquartered in Milpitas, California, California Micro Devices (CMD) designs, manufactures and markets integrated thin film,
silicon-based termination and filtering components and active electronic circuitry. Built in ISO 9000-registered quality system
environments, CMD's products target the requirements of computer, networking, and communication-based customers for
smaller, high density devices that operate at high frequencies with superior performance and functionality.
Note to Editors: (c) 1998 CMD Corp. All rights reserved.
(1) Covered by one or more of U.S. Pat. Nos. 5,355,014, 5,370,766, 5,514,612, 5,706,163, and other pending applications.
Contact:
California Micro Devices
Jeff Kalb, 408/934-3106
or
Flip Chip Technologies
Harry Hollack, 602/431-6020
or
Avex Electronics Inc.
Todd Westerbrook, 205/722-6418 |
