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To: Joe NYC who wrote (44295)	2/1/2022 1:10:52 AM
From: Vattila	Respond to of 72355

Regarding Intel in particular, what we can be pretty sure of is that Intel and TSMC do not have a co-development program for packaging, that they hence do not have a corresponding supply agreement, and hence that TSMC is unlikely to have any expansion plans to accommodate Intel in this area. Intel is touting their own packaging "leadership", with hybrid bonding coming down the line with Foveros Direct. However, I don't expect them to ship products using Foveros Direct until 2023, or more likely 2024. "Foveros Direct or hybrid bonding will also be ready for volume manufacturing in 2023." IFTLE 494: Intel Accelerated - Becoming a Foundry and Onshoring - 3D InCites "Hybrid bonding is a complex but enabling process. It enables a new class of chips and packages. AMD is first to utilize this approach, but others soon will follow. The race has just begun." Next-Gen 3D Chip/Packaging Race Begins (semiengineering.com) Another good resource: Advanced Packaging Part 1 (substack.com) Advanced Packaging Part 2 (substack.com)