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Strategies & Market Trends : 2026 TeoTwawKi ... 2032 Darkest Interregnum -- Ignore unavailable to you. Want to Upgrade?


To: TobagoJack who wrote (190078)7/21/2022 6:59:28 AM
From: TobagoJack  Read Replies (1) | Respond to of 217678
 
Re <<Dark Side of China>>

thediplomat.com

Biden’s Uphill Battle to Restructure the Global Semiconductor Sector

Is it possible – or advisable – to remake global value chains in order to boost U.S. national security?

Tian He
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Credit: Depositphotos

Securing the United States’ strong position in the semiconductor sector has been at the center of U.S. President Joe Biden’s policy agenda. The country’s strategic attention in the area is not new, but the challenges facing the Biden administration are unprecedented.

An understanding of the extent of these challenges requires reviewing the history of U.S. dominance in semiconductors. The United States has led the development and manufacturing of semiconductors, which has proven vital to its national security, throughout the post-war period. U.S. leadership was challenged only briefly in the late 1980s by the rise of Japanese semiconductor firms. U.S. chip producers quickly won out by relying on innovation rather than protectionism, solidifying U.S. dominance in the sector by the early 1990s.

Central to this dominance was the formation of a global value chain (GVC) for the semiconductor sector. Technological development, particularly in electronic design automation (EDA) software and chip design automation, led to the emergence of fabless manufacturing that focused on design and sales, while outsourcing actual production of semiconductors. The rapid emergence of East Asian semiconductor manufacturing firms that provide chip production services has allowed advanced U.S. firms to focus on chip design while taking advantage of relatively low-cost skilled labor in Asia.

Through a strong national innovation system, U.S. chipmakers (including Broadcom, Qualcomm, Nvidia, and AMD) quickly entered the top end of the value chain. With the growing value accruing to semiconductor design, chip industry innovation, and the importance of IP and intangible assets in the global ICT ecosystem, U.S. firms quickly became the dominant players in the semiconductor sector. Meanwhile, East Asian and European semiconductor companies, which occupied the middle segment of the GVC, became suppliers to U.S. semiconductor companies.

U.S. dominance in the semiconductor sector is clearly reflected in a monopoly on semiconductor design software. EDA tools come mainly from three U.S. companies: Cadence Design Systems, Synopsys, and Mentor Graphics (acquired by Siemens in 2017). Without these U.S.-made tools, it would not be possible to develop modern chips, which explains why the Biden administration’s latest export control policy vis-à-vis China is so effective.It is clear that U.S. dominance of the global semiconductor sector was built on its strength in occupying the higher end of the GVC. However, what the Biden administration is seeking to achieve is far more ambitious than what the U.S. previously accomplished.

The United States is determined to defend its absolute dominance at the top of the semiconductor GVC, and there is growing momentum for industrial policy to support the domestic chip industry. Industrial policy proposals have been emerging in Congress since the end of the Trump administration, and in mid-2020 several bills were proposed to provide financial incentives to stimulate the semiconductor industry. The U.S. Innovation and Competition Act, which includes $52 billion in federal investments for domestic semiconductor research, design, and manufacturing provisions in the CHIPS for America Fund, is regarded as the first step in preventing Chinese dominance.

However, Biden seeks more than just retaining leadership in the high end of the GVC. Since taking office in January 2021, he has prioritized both the competitiveness and security of the country’s semiconductor sector. A 100-day comprehensive supply chain review released by the White Housein June 2021 outlined a vision for the U.S. to achieve both “leadership” and “resilience” in the global semiconductor value chain.

Biden’s plan necessitates the U.S. to pay attention to the middle and lower ends of the GVC. This strategy is currently being pursued in two ways. The first is to ally with global semiconductor firms to re-shore production by building domestic manufacturing facilities. Intel announced a bold “IDM 2.0” strategy to regain its ability in advanced manufacturing and offer foundry services to other companies. At the urging of the U.S. government, both Taiwan Semiconductor Manufacturing Co. ( TSMC) and Samsunghave also announced plans to expand manufacturing facilities in the United States.

The second is the Biden administration’s intention to work with “like-minded” countries to build a more reliable semiconductor supply chain that does not involve China. Developing the resiliency of the U.S. semiconductor supply chain is a major component of the recently announced Indo-Pacific Economic Framework ( IPEF), an initiative designed to promote economic cooperation with Washington’s Asian allies.

Despite its significance for national security, the United States’ ambitious plan to address the supply chain crisis is likely to disrupt its current high-end dominance in the GVC. Specifically, there are two major challenges facing the Biden administration. First, a security-oriented “self-reliance” policy that focuses on the entire value chain would inevitably disrupt the current global semiconductor production system by incurring significant economic costs and diverting economic resources that could be used to strengthen the U.S. position at the top end.

To onshore semiconductor manufacturing, the Biden administration will first have to address the problems associated with a manufacturing workforce that no longer exists in the United States and the lack of infrastructure that is essential for rebuilding its manufacturing capacities.

Perhaps an even more critical challenge is production cost. The formation of the semiconductor GVC has enabled U.S. companies at the higher end of the value chain to obtain the best production capacity at the lowest economic cost, thus driving a virtuous cycle of technological breakthroughs and innovation. This will no longer be the case when Biden sets out to bring manufacturing back. A report by the Boston Consulting Group shows that the costs associated with operating a fab in the U.S. for 10 years will be about 30 percent higher than in Taiwan, South Korea, or Singapore, and about 37 percent to 50 percent higher than in China. Given the tremendous economic costs, bringing manufacturing back to the United States is easier said than done.

Second, the U.S. strategy of supplementing domestic production through cooperation with its technological allies could further disrupt the operation of the semiconductor GVC. Biden has looked to form techno-alliances with East Asian powerhouses to strengthen supply chain resiliency. The effectiveness of this security-centered strategy, which runs counter to economic rationales, is predicated on Washington’s diplomatic ties with its allies. Biden’s security-first supply chain restructuring efforts could affect the relationship between U.S. companies at the top end of the value chain and their suppliers at the middle and lower ends.

The uneasiness of government and capital is increasingly evident in East Asia. The Japanese government, for example, is concerned that the return of U.S. manufacturing could hollow out manufacturing in East Asia as a whole, making Japan’s ambitions to regain its semiconductor industry dominance by 2030 unlikely. In Taiwan, TSMC founder Morris Chang has also expressed skepticism about the U.S. onshoring efforts.

In short, the supply chain issue is forcing the Biden administration to overstretch U.S. capacity in semiconductors. The ambitious project to reshape the global semiconductor sector will require national mobilization and a series of diplomatic actions that will surely take a long time to materialize.

Authors

Guest AuthorTian He
Tian He is a research fellow at the Institute for International Affairs at the Chinese University of Hong Kong, Shenzhen. Much of his research has focused on the politics and political economy of East Asia. He is currently working on projects to examine the political economy of China-U.S. relations and China’s interactions with the Asia Pacific region.

Guest AuthorAnton Malkin
Anton Malkin is an assistant professor at the School of Humanities and Social Science at the Chinese University of Hong Kong, Shenzhen. His work has focused on China's integration into the global intangible economy (referring to intellectual property rights, technology standards, and data) and on multinational corporations’ role in China’s technological catch-up in the ICT sector.

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To: TobagoJack who wrote (190078)7/25/2022 10:36:40 PM
From: Julius Wong  Read Replies (1) | Respond to of 217678
 
Applied Materials: Failed China Chip Sanctions And What It Means To Non-Chinese Semiconductor Equipment Companies




Tomas Ragina/iStock via Getty Images

Failed Fujian Sanctions

In October 2018, the U.S. Commerce Department put Fujian Jinhua Integrated Circuit Co. Ltd. on a list of entities that cannot buy components, software and technology goods from U.S. firms amid allegations the firm stole intellectual property from U.S. semiconductor company Micron ( MU).

I discussed this in a November 6, 2018 Seeking Alpha article entitled “ U.S. Restricts Exports Of Some Chip Production Equipment To China - Impact On Memory And Equipment Suppliers.

Fujian recently purchased equipment from domestic supplier Kingsemi, which manufacturers products that include photolithography process coating and developing equipment, and single-chip wet process equipment, as well as single-wafer processing equipment. Fujian's Q1 2022 revenue was 180 million yuan (US$22.7 million), a year-on-year increase of 62%. As of the end of Q3 2021, the company announced nearly 1.3 billion yuan in orders in hand.

Failed SMIC Sanctions

U.S. sanctions against China's SMIC ( OTCQX:SMICY) haven't worked in the last 18 months as SMIC moved to the 7nm node using DUV lithography. I first reported SMIC moving to the 7nm node more than two months ago in a May 18, 2022 Seeking Alpha article entitled “ Applied Materials: SMIC Move To 7nm Node Capability Another Headwind.”

This was confirmed by semiconductor analyst firm TechInsights, which recently bought a cryptocurrency-mining ASIC manufactured by SMIC and found that it uses a 7nm process after doing a study of the chip's die. The ASIC is designed by a company called MinerVa.

TechInsights also noted there appears to be a "close copy" of the one used by Taiwanese foundry giant TSMC. This is also consistent with what I said in my SA article two months earlier, that TSMC had made its first 7nm chip without EUV, and SMIC was able to do the same.

China Equipment Suppliers

According to The Information Network’s report entitled “Mainland China’s Semiconductor and Equipment Markets: Analysis and Manufacturing Trends,” the major domestic Chinese semiconductor equipment manufacturers in Q1 2022 generated revenues of nearly 5 billion yuan (US$740 million), a YoY increase of 63%.

Two metrics are derived from this:

In Q1 2022, $7.57 billion in equipment sold by non-Chinese companies was imported into China. This means that Chinese company sales represent about 10% of the China market.Chinese companies grew 63% YoY in Q1 while China equipment imports increased 27% YoY, indicating the 2X growth of domestic Chinese companies.
The Information Network

Chinese equipment is not only sold to Chinese semiconductor manufacturers. Technical capabilities of the equipment have enabled equipment be put in production lines of foreign semiconductor companies.

AMEC’s etch system is used in TSMC’s 5nm fab and AMEC is developing a high aspect ratio etcher and staircase etcher for 128-layer 3D NAND manufacturing at YMTC. Other customers include SMIC, Huahong, and Huali.

At the same time, NAURA is developing etchers and deposition equipment for 7nm and 5nm nodes. NAURA has a large product offering, and its customers consist of SMIC, Hua Hong, YMTC, and GTA Semiconductors.

Chinese equipment companies supply nearly all the types of systems used to make a semiconductor chip. One type is furnace systems. NAURA also makes thermal furnaces and have a 45% share of China’s memory maker YMTC purchases.

Shenyang Piotech supplies PECVD and ALD deposition equipment and has received orders from YMTC, and is also receiving repeat orders from Hua Hong and SMIC.

What it Means for Non-Chinese Semiconductor Equipment Companies

About 20 years ago, China was forced to make chips two nodes bigger than the companies outside China, and on 8" wafers. SEMI, the industry consortia whose members include ASML and AMAT and every equipment company, lobbied congress to eliminate these restrictions because (1) China said they wouldn't make chips for military, (2) SEMI wanted members who pay fees to make more money. As a result, Congress eliminated the restrictions and now China is free to make the chips with the latest nodes on 12" wafers.

Now the U.S. is scrambling to impede China’s growth with sanctions, entity lists, and CHIPS acts. Sanctions have not impeded China, as SMIC is already at 7nm and China domestic equipment suppliers are making equipment at the 5nm node, selling to foreign chip companies, and growing 2x the rate of foreign competitors. The greed exemplified by SEMI on behalf of its members and U.S. sanctions have accelerated the determination and resolution for China to excel.

With domestic Chinese equipment companies now representing 10% of China’s needs, foreign competitors are already impacted, and that extent of impact will grow.

The semiconductor industry is facing a slowdown in consumer end products, largely as a result of a macroeconomic slowdown. But I also forecasted back in June 2021 a meltdown of semiconductor equipment that will occur in 2023, which I wrote about in my June 25, 2021 Seeking Alpha article entitled “ Applied Materials: Tracking A Likely Semiconductor Equipment Meltdown In 2023.”

Incidentally, like my article in May 2022 discussed above where I disclosed SMIC’s 7nm achievements that were confirmed two months later, analysts are now lowering their forecasts for semiconductor equipment for 2023 – one year after my analysis.

Who will be most impacted by this surge in Chinese domestic equipment growth to gain self-sufficiency?

Table 2 shows sales of equipment to China by the top foreign companies. It also shows the percentage of total company revenues coming from China. Applied Materials (NASDAQ: AMAT) will be the biggest loser. Its large exposure to China, 34% in Q1 2022, coupled with its largest revenue means that equipment revenues will erode.



The Information Network

Table 2 above showed that AMAT has Chinese competitors in each of its equipment segments, and many of these are selling equipment capable of 5nm patterning.

ASML ( ASML) is in a different situation. It already has sanctions imposed on it by U.S. Commerce, specifically preventing the export of EUV lithography to China. As I discussed in a July 6, 2022 Seeking Alpha Article entitled “ ASML: Impact Of U.S. Government Attempt To Block DUV Lithography Systems To China,” the U.S. is considering putting ASML’s DUV lithography systems on the embargo list.

Currently China's SMEE manufacturers DUV equipment, but because of fear of U.S. sanctions, the company is not divulging its node capabilities.

seekingalpha.com