To: Alan Gallaspy who wrote (313 ) 2/19/1998 4:11:00 PM From: Teri Skogerboe Read Replies (1) | Respond to of 42531
Story posted at 3:30 p.m. EST/12:30 p.m. PST, 2/19/98 ASML to roll out i-line step-and-scan system NEW YORK - ASM Lithography, Veldhoven, The Netherlands, will introduce one of the industry's first i-line step-and-scan lithography systems next Tuesday at the 1998 International Symposium on Microlithography held by the International Society for Optical Engineering (SPIE) in Santa Clara, Calif. William Maris, CEO of ASML, said the i-line scanner will make non-critical layers on a wafer in a mix-and-match configuration with the firm's current deep-UV step-and-scan system for critical layers. He was interviewed while attending the SEMInvest Conference here this week. Called the PAS-5500/400 i-line, the system has the same field size as its deep-UV counterpart. Maris said this allows chip makers to process non-critical layers for the same larger-size die that is commonly used in step-and-scan lithography. The i-line version can be sold at a price of more than a million dollars less than the deep UV scanner, he said. Rival Ultratech Stepper Inc., San Jose, Calif., for several years has sold an i-line stepper with the same field size as the SVG lithography step-and-scan systems to be used in mix-and-match processing. The Ultratech tool is a conventional stepper. Maris said the ASML i-line system offers the finer control and resolution of step-and-scan systems for non-critical layers. The new i-line tool can actually get down to 0.28-micron line widths, which makes it attractive as a stand-alone system for chip makers who don't need smaller feature size processing, he added. techweb.cmp.com