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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Elroy who wrote (93611)	6/26/2024 11:20:03 AM
From: Doug M.	Respond to of 93625

<<According to industry insiders cited by South Korean media outlet ET News, SK Hynix plans to enhance HBM with new capabilities, including computation, caching, and network memory. To support this development, SK Hynix has already invested in securing essential Intellectual Property (IP).>> 10 year agreement - it wouldn't be so long unless Hynix really needed Rambus' IP. Rambus and SK hynix Extend Comprehensive License Agreement Agreement extended by ten years to 2034, enabling long-term collaboration on products and broad access to Rambus innovations SAN JOSE, Calif. – April 4, 2023 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with SK hynix, a world leader in advanced semiconductor technology, for an additional ten years. Effective July 1, 2024, the extension maintains similar financial terms and provides SK hynix with broad access to the full Rambus patent portfolio through mid 2034. Other terms and details are confidential. Rambus and SK hynix Extend Comprehensive License Agreement - Rambus Here's more: HBM3E: Everything You Need to Know - Rambus And this is important for the future - I'll try to look up some specific Rambus IP on this: I posted this a couple of weeks ago when listening to the Bank of America analyst conference: Luc - Rambus is working with "leading" companies with HBM4 \| RMBS Message Board Posts (investorvillage.com)

To: Elroy who wrote (93611)	6/26/2024 11:49:21 AM
From: Doug M.	Respond to of 93625

Rambus is always thinking ahead in memory advancements as seen here: EP3999953A1 - Compute accelerated stacked memory - Google Patents Here's Hynix: SK Hynix Wants to Put Memory and Logic Semiconductors on One Die for HBM4 (sourceability.com)

To: Elroy who wrote (93611)	6/26/2024 12:09:50 PM
From: Doug M.	Read Replies (1) \| Respond to of 93625

This one might even be better - it also looks like Rambus has improved on Hynix's heat dissipation structure: US20220076714A1 - Methods and Circuits for Streaming Data to Processing Elements in Stacked Processor-Plus-Memory Architecture - Google Patents <<Thermal management is a serious challenge for this type of design given the high power consumption of both the memory and logic processors. According to experts, intense cooling methods will be needed to support the interface and could take several generations to perfect.>> SK Hynix Wants to Put Memory and Logic Semiconductors on One Die for HBM4 (sourceability.com) This is one of the citations in the above patent that was granted a few months ago: US20210005527A1 - Stacked semiconductor package having heat dissipation structure - Google Patents