Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : ASML Holding NV -- Ignore unavailable to you. Want to Upgrade?

To: BeenRetired who wrote (33123)	7/2/2024 9:15:33 AM
From: BeenRetired	1 Recommendation Recommended By Tobias Ekman Respond to of 42254

SiPh CAGR of 25.7%

To: BeenRetired who wrote (33123)	7/2/2024 9:40:46 AM
From: BeenRetired	1 Recommendation Recommended By Tobias Ekman Respond to of 42254

Flexible Glass Substrates Enable Large-Scale Integration Flexible glass offers advantages for new applications, device designs, and fabrication processes not possible or practical with alternative substrate materials. SEAN GARNER, CORNING RESEARCH & DEVELOPMENT CORP. A strong driving force toward increased interaction and connectivity runs through our society. And it does not end when people put down their smartphones, tablets, or smartwatches. The ability to enjoy constant connection to communication and information began with ubiquitous mobile consumer electronics, but this functionality is now becoming integrated on larger scales into items such as automobiles, video walls, and household appliances — namely refrigerators. Flexible glass provides a thin, lightweight, and bendable substrate that enables new application form factors and large-scale electronic device integration. Courtesy of Corning. Increased connectivity is no longer sought simply for interpersonal communication. The Internet of Things offers ever-increasing interactions that never existed before between objects in the environment. And as this electronic functionality migrates to new platforms and form factors, advances are needed in the underlying device technology to enable equivalent performance at these different scales and form factors. For this evolution to proceed most constructively, identification of new applications and optoelectronic device technology needs to occur synergistically. Large-scale integration of electronic functionality into interactive walls and smart surfaces provides an interesting example. A key element required for technology advancement in such an application is the electronic device substrate. Optimizing the substrate of choice Glass has already established itself as the substrate of choice in mobile devices. The material plays a key role in the design and performance of current electronic and optoelectronic devices. This includes the use of glass as substrates, backlights, and protective covers for portable electronics, displays, and energy sources such as photovoltaics. Glass substrates are chosen for these applications because of the required attributes of thermal and dimensional stability, surface quality, hermeticity, chemical and process compatibility, and optical performance. Typical glass substrates used in these applications are rigid sheets >0.3 mm thick. These glass substrates have been optimized for hand-held electronics or discrete devices and modules. To truly enable large-scale integration into interactive walls and smart surfaces, however, the substrate would ideally be optimized for thin, lightweight, and curved electronic devices. The substrate would also ideally be compatible with high-throughput manufacturing methods such as roll-to-roll (R2R) processing. Recent advances in flexible glass substrates enable these new large-area integrated applications, device designs, and manufacturing processes that are otherwise not practical or possible with alternative substrate options1,2. Flexible glass has been optimized for thin, lightweight, and conformally shaped applications that are also compatible with R2R device manufacturing. For R2R processing, the flexibility and reduced bending stress is achieved by reducing the glass thickness. For example, Corning’s trademarked flexible glass product, Willow Glass, is manufactured in a continuous process at a width >1 m, a thickness =200 µm, and at 300-m lengths. The continuous forming process enables winding the flexible glass web onto spools (Figure 1). This provides >300 sq m of high-quality glass surface for electronic and optoelectronic device manufacturing and integration. Figure 1. An example of flexible Willow Glass wound on a spool. The glass has been optimized for thin, lightweight, and conformally shaped applications and is also compatible with R2R device manufacturing. Glass width: 1.3 m; length: 300 m; thickness: 100 µm. Courtesy of Corning. The specific flexible glass attributes that distinguish it from alternative polymer film or metal foil substrates arise from the composition and forming process. For example, it has thermal compatibility >500 °C, surface roughness (Ra) <0.5 nm, a water vapor transmission rate below the measurement detection sensitivity (<3 × 10-7 g/m2/day), and optical transmission in the visible spectrum limited by the air-glass interface reflection. At this thickness, the glass is flexible, which enables R2R high-throughput manufacturing processes, as well as applications that require a conformally shaped form factor. Flexible Glass Substrates Enable Large-Scale Integration \| Features \| Nov 2018 \| Photonics Spectra PS Corning does amazing stuff with glass. Followed for years when TCZ, Team Cymer Zeiss, was viable. Stopped after it was ended. Shame.