To: Teri Skogerboe who wrote (1832 ) 2/19/1998 11:42:00 AM From: Proud_Infidel Respond to of 5867
Some more CMP news, always good for some + stock price movement: Lam Research Corporation Announces Two Papers Being Presented at CMP MIC Both Studies Used Lam's Innovative Linear Planarization Technology FREMONT, Calif.--(BUSINESS WIRE)--Feb. 19, 1998--Lam Research Corporation (NASDAQ: LRCX - news), a leading supplier of wafer fabrication equipment to the worldwide semiconductor industry, today announced presentation of two technical papers at the Third International Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP MIC). Both studies used Lam's innovative Linear Planarization Technology(TM) (LPT(TM)). The conference is being held this week at the Marriott Hotel in Santa Clara, California, Feb. 19-20. The papers will be published in the Proceedings of CMP MIC following the conference presentations. ''Effect of High Relative Speed on Planarization Length in Oxide Chemical Mechanical Polishing'' by researchers at MIT, Cambridge, Massachusetts, will be presented in Session II on February 19. The study used the Lam Teres(TM) CMP system incorporating LPT for polishing to eval uate the effect of polish speed on planarization efficiency. The long planarization length at high speed (400 ft./min.) of the Teres CMP system produced a three-fold reduction in the global oxide thickness variation within the die over that at conventional speed (approx. 100 ft./min. linear relative speed). The second study, ''A Wide Margin CMP and Clean Process for Shallow Trench Isolation Applications,'' is co-authored by researchers at Lam and Rodel Corp., Newark, Delaware. It will be presented by Rahul Jairath, Director of CMP Technology at Lam, in Session VIII on February 20. Also using Lam's LPT for polishing, this study evaluated a new approach to post-trench fill planarization the researchers hoped would open the typically narrow process window for shallow trench isolation (STI) applications. Using a slurry with high chemical selectivity of oxide to nitride coupled with the high materials removal rate and low pressure of LPT, a large process window was successfully achieved. Lam Research Corporation is a leading supplier of wafer fabrication equipment and services to the world's semiconductor industry. Lam's headquarters are located in Fremont, California. The company's common stock trades on the Nasdaq National Market under the symbol LRCX. Lam's World Wide Web address is lamrc.com .