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Technology Stocks : Disk Drive Sector Discussion Forum -- Ignore unavailable to you. Want to Upgrade?

To: Stitch who wrote (2552)	2/24/1998 6:17:00 PM
From: T Bowl	Read Replies (1) \| Respond to of 9256

Once you make the round bit into "heads" as I understood it, in the old TFI days, you'd attach that to a susp and test it on some sort of spinning rig. If the head was "bad" then the whole thing got scrapped. Now that you can static test MR heads, you might be able to catch a bad head before bonding it to a susp(with wires). So, I think what Mark was trying to get out of you is to say that because you can catch the bad head early on(before bonding it to a susp and attaching the wires), you potentially save a susp and wire bundle. This is important because he's got a bundle in those guys :) I know it's more complicated than that... So my question basically is if you make say 100heads out of one wafer, how many make it into a DD? There must be many checkpoints along the way. Where are most of the failures found? At the slider maker stage? At the bonding stage? HSA assembly stage? Maybe there's no easy answer... If so, then say go away. Follow? todd