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Technology Stocks : Qualcomm Moderated Thread - please read rules before posting -- Ignore unavailable to you. Want to Upgrade?

To: sbfm who wrote (195277)	8/19/2025 11:01:13 PM
From: engineer	Read Replies (3) \| Respond to of 197015

what is swf?

To: sbfm who wrote (195277)

8/20/2025 6:27:52 AM

From: Bill Wolf

1 Recommendation

Recommended By
ryhack

Read Replies (1) | Respond to of 197015

Here’s a refined list of chip companies that have received actual, finalized federal funding under the Biden-Harris Administration’s CHIPS and Science Act:

Companies That Received Direct CHIPS Act Funding

Intel Corporation
- Awarded up to $7.86 billion in direct funding for commercial semiconductor manufacturing and advanced packaging projects across Arizona, New Mexico, Ohio, and Oregon.
- Also received a $3 billion Secure Enclave contract for trusted manufacturing for the U.S. government.
- Intel The White House
Taiwan Semiconductor Manufacturing Company (TSMC) – TSMC Arizona
- Received up to $6.6 billion in direct funding to build three greenfield leading-edge fabs in Phoenix, Arizona.
- Complemented by up to $5 billion in proposed loans.
- U.S. Department of Commerce
Samsung Electronics
- Awarded up to $4.745 billion in direct funding to establish a leading-edge semiconductor ecosystem in Central Texas, including new logic fabs and an R&D fab.
- U.S. Department of Commerce
Micron Technology
- Granted up to $6.1 billion in federal support to build a new chip manufacturing campus in Clay, New York, and a fab in Boise, Idaho.
- Wikipedia The White House
GlobalFoundries
- Received up to $1.5 billion in direct funding to expand U.S. manufacturing in New York and Vermont, targeting chips for auto, defense, aerospace, and smart mobile applications.
- The White House U.S. Department of Commerce
SK hynix
- Awarded up to $458 million in direct funding for an advanced memory packaging and R&D facility in West Lafayette, Indiana, together with up to $500 million in loans.
- U.S. Department of Commerce
Amkor Technology (Amkor Technology Arizona, Inc.)
- Received up to $407 million to build a greenfield advanced packaging and test facility in Peoria, Arizona.
- U.S. Department of Commerce
GlobalWafers America (GWA) and MEMC (subsidiaries of GlobalWafers)
- Awarded up to $406 million to establish domestic production of 300 mm silicon wafers in Texas and Missouri.
- U.S. Department of Commerce
BAE Systems Electronic Systems
- Received $35 million for modernization of its Microelectronics Center in Nashua, New Hampshire.
- The White House
Microchip Technology Inc.
- Awarded $162 million to modernize and expand facilities in Colorado Springs (CO) and Gresham (OR).
- The White House
Rocket Lab (via SolAero Technologies)
- Received $23.9 million to expand compound semiconductor production in Albuquerque, New Mexico.
- Quartz
Entegris
- Awarded $77 million to construct a manufacturing center in Colorado Springs producing filtration products and FOUP containers.
- Quartz
Hemlock Semiconductor
- Received $325 million to build a new polysilicon crystal facility in Hemlock, Michigan.
- Midland Daily News

Summary Overview

Intel	~$7.86 B + $3 B	Advanced fabs & Secure Enclave manufacturing
TSMC Arizona	~$6.6 B	Leading-edge fabs in Phoenix, AZ
Samsung Electronics	~$4.745 B	Logic, R&D, and packaging fabs in Texas
Micron Technology	~$6.1 B	New fabrication campuses in NY & ID
GlobalFoundries	~$1.5 B	Legacy fabs in NY & VT for diverse industries
SK hynix	~$458 M + $500 M loans	HBM packaging & R&D in Indiana
Amkor Technology Arizona	~$407 M	Packaging/test facility in Arizona
GlobalWafers / MEMC	~$406 M	Domestic wafer production (300 mm)
BAE Systems Electronic Sys.	~$35 M	Chip production modernization in NH
Microchip Technology	~$162 M	MCU & specialty fab upgrades in CO & OR
Rocket Lab (SolAero)	~$23.9 M	Compound semiconductor expansion in NM
Entegris	~$77 M	FOUP and filtration products manufacturing
Hemlock Semiconductor	~$325 M	Polysilicon production facility in Michigan

Company / EntityFunding Received (Direct)Purpose / Project Overview