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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Petz who wrote (49752)	3/5/1998 10:43:00 PM
From: Paul Engel	Respond to of 186894

Petz - Re: "and the production process is less mature, so yields will be lower." You are way off on this one! The 0.25 micron process, P856, is going extremely well. Craig Barrett displayed defect density data for that process and the older 0.35 micron process (and others) last November at the analyst meeting. The 0.25 micron process defect density levels STARTED at about the same as the (then) 2 1/2 year old 0.35 micron 0.25 micron process. You are right about the dies size reduction - it is currently only 35% smaller (Deschutes) than the 0.35 micron Pentium II. That's the bad news. The good news is that Intel incorporated not only C4 bumps, but they also included full aluminum bond pads around the periphery of the chip - all 4 sides I believe. As Intel ramps up the C4 process, the bond pads can be eliminated and the Deschutes will be compacted - eliminating the pad ring. This will further decrease the die size, increase yields and reduce costs. Intel can make it so (Thanks Yousef!) Paul