Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: mikey who wrote (49903)	3/6/1998 1:18:00 PM
From: John Donahoe	Read Replies (1) \| Respond to of 186894

"would like to let you know that every device that has a heat sink attached to it has some type of thermal "goop" used in between the parts. the reason is that metal to metal contact is not a very efficient(SP) heat conductor." Metal to metal contact is best as long as you have very uniformally machined flat surfaces and sufficient contact pressure. The trade off is the difference between thermal resistivity of the "goop" layer and "metal to metal contact". The "goop" isn't zero resistivity. And it's also messy. It also adds to production costs if you have to apply it by hand. If you had a way to insure that you could mount "metal to metal" and it had better or as good thermal conductivity then the "goop" does, would you not do it? JD PS: Not every device mounted to a heat sink uses goop. I don't use it on our heat sinks. And military electronics is required to operate at much more sever environmental conditions than commercial.