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Technology Stocks : COMS & the Ghost of USRX w/ other STUFF -- Ignore unavailable to you. Want to Upgrade?

To: W.F.Rakecky who wrote (13529)	3/8/1998 9:20:00 PM
From: drmorgan	Read Replies (5) \| Respond to of 22053

Dererk does Robo/Com have patents on it's DSP architecture Good question. I think DSP's are mainly designed by TI but of course COMS does a lot of ASIC work and I'm sure (least I would think) there are patents held in that area. Here's something I found off the COMS site. Pan down to find patents. 3com.com

To: W.F.Rakecky who wrote (13529)	3/8/1998 10:09:00 PM
From: Scrapps	Read Replies (1) \| Respond to of 22053

W.F.Rakecky: Here are a couple "past" news releases from TXN which may or may not answer your question on the DSP. You may want to check around the Cirrus Logic website since they too were licensed by USR for x2. I myself don't believe USR had anything to do with the chip other than owning the code and the x2 scheme. There may have been some agreement where TXN would only sell the particular DSPs for x2 use, over some agreed upon time frame. The link to TXN search area is at the bottom here, you may want to look at the DSP # and how & who TXN would sell them to. SKOKIE, Ill. -- (May 12, 1997) -- U.S. Robotics (NASDAQ:USRX) and Texas Instruments (NYSE: TXN) announced a strategic initiative to deliver a family of affordable and upgradeable "hybrid" modems supporting both dial-up access, including U.S. Robotics' x2 56 Kbps analog, and rate adaptive Asymmetric Digital Subscriber Line (ADSL). The product family will be called x2/DSL and will run on Texas Instruments' industry performance leading TMS320C6x digital signal processing (DSP) platform. Capable of processing 1.6 billion instructions per second, the 'C6x has the processing power to implement the x2/DSL. U.S. Robotics plans to introduce x2/DSL modems in the first half of 1998. U.S. Robotics' Advanced Development Group will develop DSP software for x2/DSL and incorporate DMT algorithms for ADSL modulation recently licensed from Aware, Inc. as well x2 56K algorithms developed by U.S. Robotics. ---------------------------------------------------------------- TI DSP Chipset Backs Early Delivery of New USR High-Speed Modems Chipsets already in full production HOUSTON, TEXAS (October 16, 1996) -- Texas Instruments (TI), the industry leader in digital signal processing (DSP) solutions, announced the immediate availability of modem chipsets compliant with 56 kilobits-per-second (kbps) "x2" technology from U.S. Robotics Corp. (USR, Chicago, Illinois). TI's chipset platform for the new 56 kbps modems gives modem makers a distinct competitive advantage by providing a proven chipset that is currently in full production, and facilitates a flexible software modem solution based on a software programmable digital signal processor (DSP) chip. Because this new technology is based on existing modem chipset architectures, TI will make x2 technology available by the end of this year. Nearly 20 million modems using TI chipsets have been in mass production since 1995. This ability to swiftly deploy a new, state-of-the-art communications technique to end users exemplifies the advantage TI's software-programmable modem chipsets brings to modem manufacturers. "The promise of 56 kilobit modems certainly represents one of the biggest Internet connectivity breakthroughs in history," said Mike Hames, vice president Semiconductor Group and worldwide manager of DSP at TI. The new 56 kbps x2 technology uses traditional telephone lines to allow Internet and on-line services users to download text, image, and video data at twice the speed of today's 28.8 kbps modems. "Any kind of 56 kbps connectivity requires identical protocols both in the user's modem and at the Internet service providers [ISPs] where reprogrammable USR modems are already widely installed," continued Hames. "This alone will make x2 an automatic de facto standard for Internet access equipment." Any modem product designed using the TI chipsets, including PC modem cards, external PC modems, and Internet access equipment, will be compatible with x2. TI's operating-system-independent, and Windows(TM)-based modem chipsets are built around one of the company's TMS320 DSP cores. This lets modem product designers easily upgrade end equipment with new technology through software reprogrammability both at the host level and at the DSP level, protecting end users against hardware obsolescence. According to Casey Cowell, chairman, CEO, and president of U.S. Robotics, "USR has long depended on programmable TI DSP solutions to give our modems significant performance advantages, and we are pleased to be working with Texas Instruments to bring this new technology to market. Based on TI's leading DSP technology, we will be able to upgrade many of our existing modem architectures without any hardware changes. This flexibility is key in bringing x2 to market quickly." TI has emerged as a clear leader in providing modem chipsets to end-equipment vendors. For example, TI was first-to-market with modem chipsets supporting 33.6 kilobit-per-second cohttp://www.ti.com/sc/docs/dsps/products/data/x2news.htmnnection speeds, and to date, nearly 20 million V.34 modems have shipped using TI DSP chipsets. Advanced, DSP-based handshaking techniques let TI-based modems connect over a highly unpredictable assortment of line conditions throughout the worldwide telecom infrastructure. The new x2 modems are based on these same chipsets and are already in trial use at 56,000 bits-per-second at selected ISP sites. ti.com

To: W.F.Rakecky who wrote (13529)	3/9/1998 10:39:00 AM
From: Moonray	Respond to of 22053

Siemens and 3Com to Roll Out Stackable Solutions for Voice and Data 10:11 a.m. Mar 09, 1998 Eastern SANTA CLARA, Calif.--(BUSINESS WIRE)--March 9, 1998-- Strategic Alliance Delivers New, Converged Communication Systems for Lowest Cost of Ownership and Increased Business Performance Siemens AG and 3Com Corporation (Nasdaq: COMS) today announced the next steps in their strategic alliance with a roadmap of new product developments that will deliver the industry's first stackable networking solutions for converged voice/data networks. Designed to meet the needs of enterprise users, these new solutions will lower the cost of ownership of voice and data business communication systems. In a related announcement today, the two companies unveiled their joint plans to introduce a leading-edge convergence solution for network service providers - the industry's first multi-services central office switch. First Stackable Solutions for Voice and Data The new stackable solutions to be introduced by 3Com and Siemens under their own brand names, will include leading-edge data and voice communication components such as: -- an H.320/H.323 real-time communication gateway, enabling voice and video communication between devices connected to IP and telephone networks; -- a communication server based on Siemens' Hicom technology, offering advanced telephony features and support for computer telephony integration (CTI); switches equipped with standards-based IEEE 802.1p traffic prioritization software, enabling class-of-service for real-time communication such as H.323 voice and video conferencing. The products to be made available this year will provide significant customer benefits such as: -- Reduced communication costs for voice and data for businesses -- One communication and wiring center for all voice and data needs -- Ease of integration -- One vendor contact for service and support of integrated voice/data solutions -- Guaranteed interoperability of voice and data communications between Siemens Hicom and 3Com LAN equipment -- Access to ISDN/PSTN services such internet access from any PC connected to the LAN -- Support for enhanced "voice plus data" applications such as CTI (with application-based dialing, automatic display of caller-related information on the PC-screen) and and H.323-based multimedia conferencing including NetMeeting These new product developments confirm the commitment made by 3Com and Siemens to leverage the benefits of IP technology in the converging voice/data markets. Under the terms of their alliance which was announced in 1997, 3Com and Siemens are delivering systems that offer the highest level of voice and data convergence. The innovative systems packaging will lower the cost of ownership of enterprise networks and enable advanced applications that allow users to achieve competitive advantage through increased business efficiency. The new product development roadmap for CY98 is as follows: Q2CY98: Siemens to market LAN products under their own brand name based on 3Com's SuperStack II and CoreBuilder technology including the Super Stack II Entry Level Hub; PS Hub 40 and 50 and the CoreBuilder(TM) 3500 Layer 3 high-function switch solution. These products will be displayed on the Siemens stand at CeBIT, Hanover, Germany 19-25 March 1998. Q3CY98: As part of the stackable solution, 3Com and Siemens will deliver a new H.320/H.323 communication gateway. Q3CY98: Siemens to market 3Com's SuperStack II Dual Speed Hub 500, Switch 1100 and 3300 switches under the Siemens brand name. Q4CY98: 3Com to market a stackable, Hicom-based communication server under the SuperStack II brand name. "With the new, class-of service-enabled Ethernet products, voice/data integration including real-time communication over IP networks has now become reality", said Karl-Joachim Veigel, president of Siemens Network Systems Division. "Our alliance with Siemens is already achieving its first results, enabling 3Com to enter new markets in voice and data convergence", said Ron Sege, senior vice president 3Com Enterprise Systems. "Our new stackable solution for enterprise customers will deliver the industry's most cost-effective, IP-based business communications systems." "The ability to guarantee high quality of service for mission critical telephony transmissions over IP networks is a fundamental criterion for the convergence of voice and data. In bringing their core competencies together, Siemens and 3Com will allow users to maximize the full potential of their supporting communications infrastructures and network services to achieve lower cost of ownership." said Terry Wright, market analyst Dataquest. 3Com and Siemens also announced today further plans for voice and data convergence (See March 9 press release entitled, "3Com Corporation And Siemens Public Communications Networks Integrate Internet Gateway With Digital Switch To Produce First Ever Multi-Service Central Office Switch."). Today's announcements confirm the July 9, 1997 commitment made by the two companies to leverage the benefits of IP technology in the converging voice/data markets for both enterprise and public network markets. About 3Com Corporation 3Com Corporation enables individuals and organizations worldwide to communicate and share information and resources at anytime from anywhere. As one of the world's preeminent suppliers of data, voice and video communications technology, 3Com has delivered networking solutions to more than 100 million customers worldwide. The company provides enterprises, network service providers and carriers, small businesses and customers with comprehensive, innovative information access products and system solutions for building intelligent, reliable and high performance local and wide area networks. For further information, visit 3Com's World Wide Web site at 3com.com, or the press site at 3com.com. About Siemens Private Communication Systems Group The Siemens Private Communication Systems Group (PN) is one of the world's largest providers of communications solutions for companies and private customers. With a market share of 12 percent PN is the global leader in communication systems and ranks third in the terminals business. With around 34,000 employees, PN sales reached approxi-mately DM11.1 billion in fiscal 1996/97 (30 September). For more information please visit our Web site at siemens.de. 3Com and SuperStack are registered trademarks and CoreBuilder is a trademark of 3Com Corporation. All other brands and names are the property of their respective owners. Hicom is a registered trademark of Siemens AG. (See also: businesswire.com) o~~~ O