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Technology Stocks : IDTI - an IC Play on Growth Markets -- Ignore unavailable to you. Want to Upgrade?

To: FactBoy who wrote (7604)	3/30/1998 3:26:00 AM
From: flickerful	Respond to of 11555

fact boy.... the facts, sir..just the facts. always good to see our lean, mean (and authoritative) posting machine. thanks for setting the record straight ( again)... take care, randy

To: FactBoy who wrote (7604)	3/30/1998 12:40:00 PM
From: Rob S.	Read Replies (1) \| Respond to of 11555

Thanks for the clarification - I didn't think that IDT owned 36%+ of QED at this time. Any word on how the ramp is going for the C6 and whether the time-line on introducing the C6+ is on schedule? What is IDT doing about compliance with "Super Socket 7" or coming out with their own, or a joint effort with AMD, on a slot type architecture? Super Socket 7 was originally supposed to come out early this year but has yet to appear in quantity (Tom's Hardware site reports about one early release mother board they have tested but I have not seen it for sale anywhere). IMO, SS 7 will only be an interim solution until the non-Intel competitors agree on a new architecture for "mainstream" PCs. IDTI has gotten the agreement with IBM to augment their mfg. position but the big question remains how well the ramp is going on the C6 and introduction of the C6+ and tied to that how well the parts are yielding. It has been reported that IDTI expects to shrink the C6 to a 58 mm die size at IBM and their own 0.25 (0.28) fab lines. The expectation would be that this should yield extremely well and will result in a large number of good die per 8" wafer. If that holds true, the majority of the cost in a C6 266 MHz part will likely be in the packaging and testing rather than the raw die cost. Questions I have are what is the expected die size and how many metal layers for the C6+? Intel and AMD, NSM and IDTI to a large extent are still racing down the momentum path toward higher performance CPUs. The real bottleneck is delivering practical bandwidth to the internet and other communications. Many people think that cable modems, XDSL or broadband wireless will deliver the solution. However, even the most generous forecasts predict only a 10%-20% penetration by these technologies over the next few years. Perhaps a more modest approach is necessary for the mass market. This may include seemless and efficient modem bonding (WIN 98 supposedly will support this but I haven't gotten it to work under the beta). Maybe the networking product gurus at IDTI can figure out how to attack this problem better than INTC or others - more efficient partitioning of PC resources or a sepparate communications pump pipeline - IMO a well thought out and executed interum solution would be a big ticket to ride until the more advanced technologies are widely and cheaply available (we can all count on our local phone companies to deliver this real soon because of all the billions we throw at them - yea, ya betcha!).