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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: SMALL FRY who wrote (18331)	3/31/1998 9:33:00 AM
From: Paul V.	Respond to of 70976

SMALL FREY, 3/31/98 posting, Paul V. SGS-Thomson Selects Applied Materials' Ultima HDP-CVD Centura as Production Tool of Record Business Wire - March 31, 1998 07:17 %APPLIED-MATERIALS AMAT %CALIFORNIA %ARIZONA %COMPUTERS %ELECTRONICS %COMED %PRODUCT V%BW P%BW European-Based Semiconductor Manufacturer Chooses Ultima for Critical Shallow Trench Isolation and Intermetal Dielectric Applications SANTA CLARA, Calif.--(BUSINESS WIRE)--March 31, 1998-- SGS-Thomson(ST), one of Europe's largest and most diversified chipmakers, has selected Applied Materials' Ultima HDP-CVD(TM) Centura(R) system to deposit the critical dielectric films used in advanced logic devices manufactured at the ST production fab in Phoenix, Arizona. Dennis Gonsalves, SGS-Thomson's vice president of operations for North America, said, "We found the Ultima HDP-CVD Centura to have both the process technology and manufacturing productivity necessary for our most critical dielectric film applications. The Ultima HDP-CVD was selected over other HDP-CVD systems based on its technical and economic performance depositing undoped silicate glass (USG) for intermetal dielectrics (IMD). We have qualified the system for our advanced device designs and are now moving it into high-volume production." High-Density Plasma Chemical Vapor Deposition (HDP-CVD) technology is one of the most critical semiconductor processing technologies needed to manufacture advanced logic, microprocessor and memory devices using 0.25 micron and below design rules. HDP-CVD is used to fill the very small, narrow gaps between conducting circuits with insulating (dielectric) materials, including emerging "low (kappa)" or low dielectric constant materials. Applied Materials' Ultima HDP-CVD Centura system is designed for superior gap-filling capability and has the flexibility to deposit a variety of dielectric materials. This feature extends the system's usefulness across multiple device generations and film applications such as fluorinated silicate glass (FSG), amorphous fluorinated carbon ((alpha)-FC), and phosphosilicate glass (PSG). "SGS-Thomson is extremely demanding in its CVD requirements," said Dr. Farhad Moghadam, appointed vice president and general manager of the HDP-CVD Product Unit and Emerging DCVD Technologies at Applied Materials. "The company's choice of the Ultima HDP-CVD Centura system for production applications is very rewarding. Our customers appreciate the tremendous flexibility of the chamber and source design that allows the system to operate at high productivity for both IMD and STI applications. We are quickly ramping our production of the Ultima to meet the strong demand from chipmakers using the system for a broad range of device generations and applications." Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market System under the symbol "AMAT." Applied Materials' web site is appliedmaterials.com. CONTACT: Applied Materials Inc. Betty Newboe, 408/563-0647 (editorial/media) Carolyn Schwartz, 408/748-5227 (financial community)