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To: John Donahoe who wrote (52006)	4/3/1998 5:23:00 PM
From: Paul Engel	Respond to of 186894

John - Re: "I'm assuming then that the package surface temperature is maintained close to these temperatures" The case temperature will rise above the ambient somewhat - due to the normal Theta C-A, Case to Ambient Thermal resistance. This of course applies for dynamic air-flow (as opposed to STATIC) - since the air-flow inside a burn-in/life etst oven is quite high - due to convective air flows, designed to maintain all parts of the oven within a degree or two of the "control" point. Re: "ALso do you know the recommended and absolute maximum ambient air and case temperature ratings of these devices?" The standard guideline for maintaining silicon reliability is to keep the silicon junction temerature (i.e., the silicon device itself) BELOW 150 C Maximum. To that end, device packaging and cooling guidelnes are established to mainatain the device PACKAGE, or CASE, temperature, below a given limit such that the junction temperature is maintained below the 150 C upper limit. Thus, the Theta J-C and Theta C-A (Junction to case and case to ambient) thermal resistances must be well characterized for each device, as well as the device power dissipation. Paul