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To: Maxwell who wrote (52104)	4/5/1998 10:17:00 AM
From: Kirk ©	Read Replies (2) \| Respond to of 186894

Maxwell, Thank-you for the information. Sometimes this thread is better than being in College 19 yrs ago when I took my IC processing class. Much has changed! Are back-end process so much "dirtier" because they involve adding and removing material (metal and passivation) which is just harder to clean as opposed to diffusions and oxidations which are fairly clean by nature? I always wondered why we had to pay so much more for "just" an extra layer of metal on a complicated bicmos wafer. From your hint, it seems that we are paying for the extra yield loss. best regards Kirk