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To: db who wrote (3396)	4/6/1998 4:23:00 PM
From: db	Respond to of 6180

Demand puts PC-100 DRAMs under scrutiny By Ron Wilson SAN JOSE, Calif., A sudden jump in demand for very fast synchronous DRAMs has helped pull Intel Corp.'s PC-100 specification into the mainstream of the personal computer market, according to George Robillard, vice president of Fujitsu Microelectronics Inc. "Initially, the industry had been focusing on PC-100 for the first quarter of this year," Robillard said. "But in the first quarter nothing much happened. Now we are seeing a real burst in demand for SDRAMs that can meet PC-100 requirements, both from some major OEMs and from some module vendors." For modules to comply with the PC-100 spec, they must hold SDRAMs that are capable of operating at about 125 MHz. The chip maker supplying the SDRAMs and the module maker must judiciously allocate the modules' flight times, set-up, hold and access times to see that the overall module complies with Intel's stringent specification. The increased demand for such chips has raised a number of debates over chip and module timing. Module vendors are reportedly discovering significant differences in timing between SDRAMs from different vendors, all of which nominally can meet the PC-100 requirements. Another emerging issue involves a spec known as CL-2 -- the ability of the module to initiate its first transfer two clocks after the CAS signal is sent from the system controller. While there is little difference in application performance between systems using CL-2 or CL-3 modules, the difference is detectable by synthetic benchmarks, and hence has marketing significance. Vendors are currently seeing low yields on parts that are fast enough to meet the CL-2 timing spec, so compliance has become a bragging point for DRAM vendors as well as systems vendors. Toshiba America Electronics Corp., for example, has announced that its parts comply with CL-2. CL-2 will be more readily achievable once DRAM processes migrate from 0.30 to 0.28 microns, said Fujitsu's Robillard.

To: db who wrote (3396)	4/6/1998 4:52:00 PM
From: db	Respond to of 6180

Acer, TI reach final agreement in sale of DRAM joint-venture TAIPEI, Taiwan--The Acer Group and Texas Instruments Inc. today said they have reached a definitive agreement to end their joint venture in DRAMs and to turn the operation into a subsidiary of Acer. After months of negotiating, the two companies last month reached a preliminary agreement for Acer to purchase TI's shares in the TI-Acer Inc. see March 4 story). The TI-Acer plant includes an 8-inch wafer fab line and a six-inch wafer line. It is now producing 16-Mbit and 64-Mbit DRAMs using 0.28-micron technology. During a transition period Dallas-based TI will continue to purchase 16-Mbit and 64-Mbit DRAMs from this facility for one year. Acer plans to use the subsidiary to move into the silicon foundry business. The operation will be called Acer Semiconductor Manufacturing Inc. Acer is also looking for a technology partner (see March 4 story). "This strategic action enhances Acer's business goals to move into the semiconductor foundry business," said Stan Shih, chairman and chief executive office of Acer. "We have stated that we wanted to be a major player in the semiconductor manufacturing area. With this agreement, Acer will acquire one of the largest and most advanced wafer fabs in Taiwan, capable of producing a variety of advanced integrated circuits." As part of the agreement, TI and Acer have agreed upon the essential terms of a 10-year semiconductor patent cross license agreement between TI and Acer Semiconductor Manufacturing. Under the terms of the license agreement, ASMI will be licensed to manufacture its own products as well as to act as a foundry for the products of other companies.