Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Petz who wrote (31475)	4/8/1998 1:25:00 PM
From: Paul Engel	Respond to of 1571924

Petz - Re: " Is there an additional dropout (zero good die/wafer) due to misalignment " Alignment checks are made on set-up wafers for Wafer Steppers prior to lot processing, and automated or manual test equipment is available for production sampling or inspection of printed wafers. Any wafers that were misprocessed (and not re-worked) would be included in the line yield numbers. By the way - re-working of wafers (or finished die in assembly) is not done in well run fabs. Too much effort is expended in trying to fix mistakes. Instead, more effort is put into processing the wafers correctly the first time - and re-work is not an issue. Misprocessed wafers become scrap. Paul