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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?


To: Maxwell who wrote (31684)4/10/1998 11:49:00 AM
From: AK2004  Read Replies (1) | Respond to of 1573431
 
Maxwell
maybe Yousef is right and no one was working on .18 at AMD. IBM may be doing pretty good job for them so AMD did not have to. :-))
Regards
-Albert



To: Maxwell who wrote (31684)4/10/1998 10:42:00 PM
From: Yousef  Read Replies (2) | Respond to of 1573431
 
Maxwell,

Re: "So tell me something about your 0.18um process ..."

Another one of your "silly" tests, Maxwell ... Is this your homework from
Bert's "school of fools" ?? I will help you get an "A+" on your assignment. <ggg>

1) Gate oxide will be 35A (electrical), 27A (physical)
2) Gate length will be .15um printed with .08um Leff
3) TiSi2 will be used (just like .25um)
4) The contacts will be .24um
5) Will use HDP (High Density Plasma) oxide dep
6) Will experiment with fluorinated oxides (K ~ 3.6)
7) Yes, tungsten plugs will be used
8) To get good step coverage, will use IMP (Ionized Metal Plasma) Ti
deposition and will investigate CVD TiN dep
9) Aluminum, copper will be used for .13um
10) Metal 1 will be .48um pitch and Metal 2 will be .68um pitch
11) 6 metal layers
12) will use KrF 248nm scanners
13) Max die size will be limited by I-line tools that will be used at
non-critical layers, so max die size will be 22mm X 22mm.

This should get you a good grade from Bert ...

Make It So,
Yousef