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To: Paul Dieterich who wrote (471)	4/14/1998 1:18:00 AM
From: FJB	Read Replies (2) \| Respond to of 582

Hyundai Predicts DRAM Shortage By End of 1998 sumnet.com An Intel spokesman attributed the delay in construction of Fab 16 to a shift from a planned 200mm, 0.25-micron facility that was scheduled to open in late 1999 to a 300mm, 0.13-micron plant, now scheduled for 2002. The spokesman also said Intel, which has been victimized by lagging sales, has more than enough 0.25 capacity and would like to start planning for next generation facilities. "We are experiencing high yields at 0.25-micron, and we are way ahead of everyone else," the spokesman said. "That gives us the opportunity to move Fab 16 to 0.13-micron." ... Mr. Burns said Intel is at least partially to blame for the pushback of the 300mm era. "In part," he said, "300mm is being pushed back because of Intel's aggressive, successful shrink program." He said Intel is converting several fabs to 0.25-micron and is eyeing a move to the next generation 0.18-micron process technology. According to Mr. Burns, ASIC and DRAM manufacturers have been following Intel's lead in shrinking feature sizes in lieu of shifting to 300mm. Shrinking feature sizes can give chip makers 25-40 percent more die per wafer, he said. "This is a way of adding capacity without building fabs," Mr. Burns said. "They are squeezing more out of that 200mm capacity." Milind M. Bedekar, a capital equipment analyst for Prudential Securities, said companies are finally shifting to 300mm because of uncertainty facing future generations of shrinks. "Currently, you don't have steppers that allow you to print 0.18-micron or 0.13-micron geometries," he said. "This is a problem we are going to have to face. I would suspect we will see a lot more of these announcements as we go forward." sumnet.com