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To: Mr. Aloha who wrote (16597)	4/16/1998 2:56:00 PM
From: Doug Moulton	Read Replies (2) \| Respond to of 25960

To All: Here we are running up against 24. I would love to see it bust through this time. I think a little help from the market just might make it possible. doug

To: Mr. Aloha who wrote (16597)	4/16/1998 3:10:00 PM
From: BillyG	Respond to of 25960

Applied announces a new tungsten CMP process for use with designs under .35 micron. This is another of the set of tools, including DUV lasers, that are needed for deep submicron manufacturing. techweb.cmp.com <<Applied Materials Inc. here today announced a tungsten process capability for its Mirra chemical mechanical polishing (CMP) system. The process is expected to improve wafer processing yields by enabling more precise and cost-efficient planarization of tungsten "plugs" used as contacts and vias in deep-submicron devices under 0.35 micron.>>