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To: REH who wrote (3885)4/22/1998 8:51:00 AM
From: REH  Respond to of 93625
 
Kingston Announces Family of High Performance PC 100-Compliant Memory Modules
System-specific 100MHz Memory Modules Immediately Available in Quantity to OEMs, Systems Integrators and Resellers
FOUNTAIN VALLEY, Calif., April 20 /PRNewswire/ -- Kingston Technology Company today announced its PC 100-compliant memory module family designed to meet the high-performance requirements of the new 100MHz memory bus architecture of Intel's new 440BX chipset. Utilizing 100 MHz unbuffered SDRAM (Synchronous Dynamic Random Access Memory) components, the modules will be offered in system-specific configurations of 32, 64 and 128MB densities.

Evaluation units have already been provided to Kingston's semiconductor and PC-OEM manufacturing partners. System-specific modules will be available to resellers in quantity as OEMs begin shipments of 440BX-based systems. Prices for modules will range from $130 to $635 (MSRP) depending on configuration and capacity.

''At the core of Kingston's 100MHz strategy is its ability to rapidly integrate these new technologies into our design, manufacturing, test and logistical process to provide industry leading time-to-market and time-to- volume production for our customers,'' said Gary MacDonald, Kingston's senior vice president of sales and marketing. ''Moreover, as one of the world's leading buyers of DRAM chips, Kingston has the ability to secure large quantities of the fully Intel spec compliant SDRAMs that will be required to keep up with significant OEM and reseller demand.''

SDRAM Challenge

The move to PC 100 SDRAM technology offers tremendous performance benefits, it also creates significant challenges that must be overcome by manufacturers and understood by quality conscience OEMs, resellers and end users. With 100MHz SDRAM, the design of the module itself becomes critical to the performance of the entire system. If certain critical timing requirements are not met, undetectable data corruption could occur; data must be routed from each individual memory chip across the module through the system bus to the memory controller on the motherboard, with all signals remaining in sync with the processor. Any lines routed too close to each other are highly susceptible to failure. Additional design issues include signal integrity, component quality, testing and compatibility -- all of which must be addressed to ensure peak performance from the module.

''As SDRAM becomes the dominant memory technology, module issues like design quality and testing grow in importance. OEMs and integrators need to consider these issues, as well as price, when choosing memory module suppliers,'' said George Iwanc, analyst, Memories Worldwide Semiconductor Group at Dataquest. ''The challenges of advancing SDRAM technology will likely shake out some of the weaker module manufacturers.''

Quality Manufacturing

Part of Kingston's strategy is to ensure total reliability with the new DRAM architectures, such as SDRAM and Rambus has been to institute a quality control process called DCAT (Design, Components, Assembly, Test), to ensure total reliability. ''In addition to its widely established channel business, Kingston is the largest, most rapidly growing contract manufacturer to PC OEMs and DRAM manufacturers. As such, Kingston works closely with some of the best manufacturing companies in the world,'' said John Cheng, Kingston's director of advanced technology. ''The insight and experience gained in working with these OEM customers is constantly used to enhance our processes, enabling us to consistently be first to market with system-specific products for OEMs, resellers and DRAM manufacturers.''

Design -- To guarantee 100 percent reliability and compatibility, Kingston's modules are individually designed to meet the specific requirements of each manufacturer's systems. Since memory performance varies slightly between manufacturers and certain components are incompatible with certain motherboards, Kingston design standards call for in-system qualification of every new module design. In addition, the design specifications for all of its PC 100 class modules meet or exceed industry requirements, including those outlined in the Intel's 440BX specifications.

Components -- Kingston's proactive Supplier Quality Program certifies and monitors memory chips, boards (PCBs), passive components. Kingston has established strict control requirements that subject component lots received to testing for compliance with Kingston and Intel specifications. For example, memory chips are sample tested using HP 83000 testers to verify PC 100 compliant timing characteristics. If the design of an SDRAM chip is altered in any way, it must be requalified.

Assembly -- All memory chips are sent directly from the manufacturer to the assembly plants to minimize handling and reduce the chance of damage and numerous steps are taken throughout the entire assembly process to eliminate the possibility of electro-static discharge, which is the leading cause of memory failure.

Testing -- Kingston employs a multi-tiered testing system to ensure quality control throughout the manufacturing process. In addition to the rigorous tests performed on DRAM and other components, Kingston is now subjecting all new module designs to signal-quality testing, software stress testing, thermal testing and system-specific, long-term reliability testing. Kingston has also continued its long-standing practice of building proprietary testers -- in conjunction with the use of the HP 83000 -- to evaluate every completed module it produces.

''Testing has always been of utmost importance to Kingston because our customers are either OEMs, who have established very high quality standards around their brands, or resellers and integrators who prioritize reliability, availability, value and support,'' said Nahid Casazza, memory product manager at Kingston. ''With the emergence of 100MHz and beyond, we will continue to lead the industry in both design innovation and testing, where our mantra is to test every cell on every chip of every module.''

Kingston Technology is the world's largest manufacturer of memory products for servers, workstations, desktops, portables, and electronic devices and is one of the fastest growing contract manufacturers to DRAM manufacturers and PC OEMs. Over the last ten years, Kingston has diversified its product lines to include processor upgrades, flash memory, networking hardware, and storage products. With strictly regulated ISO 9001 facilities in the United States, Ireland and Taiwan, Kingston markets its products through an extensive worldwide network of distributors, major reseller chains and independent dealers.

In August of 1996, Kingston became part of SOFTBANK Corp. SOFTBANK Corp. is the largest software provider in Japan, the world's largest publisher of computer-related Magazines, and the world's largest producer of technology- related trade shows and expositions. Visit the Kingston home page on the Internet at: kingston.com. For additional information on Kingston products, please contact Kingston Technology at (800) 337-8410.



To: REH who wrote (3885)4/22/1998 9:01:00 AM
From: REH  Read Replies (1) | Respond to of 93625
 
Kingston and Rambus: This off Kingston's web-pages which I found very informative:

Memories Worldwide
Dataquest's Tactical Memories Newsletter Vol. II, No. 20

The following analysis, from Dataquest, gives an overview of Kingston's place in the next-generation world of Rambus:

SIMMs, DIMMs, and Now RIMMs

Eighteen companies, including DRAM, memory module, connector, clock chip, and test equipment manufacturers, announced support for Rambus Inc.'s Direct Rambus DRAM (RDRAM). In related announcements, Kingston Technology Company... [one] of the 18, made joint statements with Rambus that it will manufacture and distribute memory modules that support the Direct Rambus high-speed memory interface. The announcements coincide with Rambus' disclosure of the Direct Rambus main memory system packaging at the inaugural Intel Developer Forum in Burlingame, California. The Direct RDRAM modules for use in PC main memory will be known as Direct Rambus RIMM modules.

DQ Take

There are two important points in these announcements. One is that technology advances in DRAM may change the landscape of the third-party memory module industry. And the second is that Rambus is actively preparing the infrastructure needed to manage the transition to this new interface.

Third-party memory module manufacturers pride themselves on being service-oriented companies and not necessarily technology leaders. The current transition to SDRAM and then the following transition to next-generation memories like Rambus will challenge their business model. The design, manufacture, and test of SDRAM and Rambus modules will prove to be much more daunting than the board stuffing of the past, which may trigger an industry consolidation. Kingston,...well-positioned, is stating with their announcement that they are committed to succeeding in this changing market. Dataquest expects that many of the other top module companies will follow with similar announcements.

The infrastructure issue is critical for Rambus. Intel's memory road map designates 1999 as the starting point for the transition to Direct Rambus in PC main memory. For this to have any chance of occurring, not only will Direct RDRAM chips and an associated chipset have to be available, but the memory system infrastructure (testers, modules, connectors, and so on) will also have to be ready.

link: kingston.com

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kingston.com

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Kingston To Offer Direct Rambus System Memory Modules
Fountain Valley, CA (September 30, 1997)
Kingston Technology Company and Rambus Inc. today jointly announced that Kingston will manufacture and distribute memory modules that support the Direct Rambus? high-speed memory-interface technology. The agreement broadens Kingston's manufacturing capabilities and its role as a pioneer in a whole new era of high-bandwidth memory solutions.

Kingston's first products to use Direct Rambus DRAMs will be Direct Rambus RIMM? memory modules, which were disclosed today at the inaugural Intel Developer Forum in Burlingame, California. Kingston plans to ship production quantities coincident with chipset and Direct RDRAM? availability. PC system memory is expected to begin using Direct Rambus DRAMs in 1999.

"Kingston is addressing the need for Rambus high-bandwidth memory interfaces by broadening our manufacturing methods. We are adapting our design, testing methodologies and production processes to deliver superior quality Direct Rambus RIMM modules," commented David Sun, Kingston co-founder and vice president of engineering.

"Kingston's early commitment to Direct Rambus will be a key factor in realizing volume production of Direct Rambus RIMM modules," said Allen Roberts, vice president and general manager of Rambus Inc.'s Memory Technology Division. "It takes the leadership and support of companies like Kingston to realize the full benefits of Direct Rambus technology."

Adhering to its commitment for premium quality product, Kingston RIMM modules will be 100% compliant with the Direct Rambus RIMM Module Specification. For the production of Direct Rambus RIMM modules, Kingston will acquire Direct Rambus DRAMs directly from Rambus licensees. To further ensure quality and reliability, Rambus will periodically inspect manufacturing processes and ascertain consistent specification compliance. Additionally, Kingston's testing techniques and know-how will be shared with Rambus.

"Bandwidth of PC memory buses is becoming increasingly important as an enabler of applications. Current Rambus components have a peak transfer-rate bandwidth of 600 megabytes per second. This bandwidth helps pave the way to achieving Intel's goal of increasing PC memory buses to a transfer-rate bandwidth of 1.2 gigabytes per second by the year 1999," said Paul Popadak, senior product engineer, Kingston.

"Kingston RIMMs are key to serving the future successful development efforts of our three customer segments: PC systems manufacturers, DRAM manufacturers and PC distribution channel partners," added Gary MacDonald, vice president of sales and marketing, Kingston.

Earlier this year, Intel selected Direct Rambus as its DRAM interface architecture of the future, signaling that PC main memory is likely to have a Rambus interface. According to the February 1997 In- Stat DRAM Market Quarterly Forecast Update, the RDRAM share of the DRAM market, is expected to be about 30 percent by the year 2000 and close to 50 percent by 2001.

link: kingston.com

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Kingston and the Rambus Connection

Backgrounder

Rambus Inc. is a high-speed interface technology development and marketing company located in San Jose California. Intel and Rambus codeveloped a next generation PC main memory controller. Rambus' revolutionary chip to chip interface architecture improves PC main memory by increasing data transfer rates, thus boosting bandwidth. As faster microprocessors continue to support cutting-edge multimedia applications, memory must keep pace. Rambus technology solves the memory bottleneck by increasing data transfer rates with low cost manufacturing advantages. As a result, Rambus' solution has the most immediate promise with PC manufacturers and upgrade module solutions providers such as Kingston. Intel's memory roadmap indicates that Rambus will be widely adopted by PC system designers by 1999.

Remember, Rambus doesn't manufacture product, rather it licenses its technology and lives off of royalty revenues. Therefore, Rambus is challenged with building the industry infrastructure to support their innovations. At the end of September, Kingston was among 17 other companies that publicly stated their support for the Direct Rambus specification. Included in the announcement were DRAM manufacturers, connector and clock-chip makers as well as test equipment suppliers.

RDRAMs comply with the Direct Rambus specification for next generation 64 Mbit DRAM chips. DRAM manufacturers will produce these RDRAMs for companies like Kingston or PC manufacturers to build into RIMMTM modules. A RIMM module delivers a peak bandwidth of 1.6 Gbytes/second using conventional printed-circuit board technology and is similar to the currently available dual in-line memory module (DIMM). The RIMM module is expected to fit within the same physical, thermal and power profiles as 100-MHz SDRAMs.

A Kingston Perspective

Kingston is working closely with Rambus engineers to offer next-generation product solutions for the memory industry. Kingston's development efforts include implementations of Base, Concurrent and Direct Rambus specifications. In October, Kingston announced that we will manufacture and distribute memory modules supporting the Direct Rambus specification. Kingston's first Direct Rambus products will be Direct Rambus RIMM memory modules. Production quantities are expected to coincide with chipset and Direct RDRAM availability. Kingston will broaden its manufacturing methods and adapt its design, testing, and production to realize volume production to serve the needs of all customer segments: PC distribution channel partners, OEM relationships with PC manufacturers and DRAM business partners.

link: kingston.com

reh