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To: Paul Engel who wrote (54100)4/22/1998 6:17:00 AM
From: Pigboy  Read Replies (1) | Respond to of 186894
 
Paul,

<< Intel will be ramping their flip-chip/C4 bonding process, using entirely different
equipment - no wire bonders required. The main vendor for this is not currently K
& S. >>

Do you know who it is? A hint, perhaps?

thanks
pigboy



To: Paul Engel who wrote (54100)4/23/1998 12:41:00 PM
From: andy kelly  Read Replies (1) | Respond to of 186894
 
Paul

Thanks for your response regarding equipment cancellations.

Flip-chip/C4 bonding process-wow, this sounds great, go Intel!<g> Only problem is I don't have a clue what that means. For the benefit of all us non-techies could you please give a brief explanation of this and its implications. Thanks in advance.

Andy


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