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To: Maxwell who wrote (5803)4/26/1998 11:49:00 PM
From: Yousef  Read Replies (1) | Respond to of 6843
 
Maxwell,

Re: "I just talked to some experts on Cu dual damascene at MOT."

Well Maxwell, maybe you need to talk to them again ... what barrier
material are they sputtering as a seed layer. Are you sure that they
are sputtering this material ?? It's awfully difficult to sputter
material down into .25um trenches that are .7um deep. I really wouldn't
believe this ... you will get much more deposition at the corners rather
than at the bottom.

Make It So,
Yousef



To: Maxwell who wrote (5803)4/27/1998 1:11:00 AM
From: Paul Engel  Respond to of 6843
 
Maxwell - Re: Motorola Copper Technology

Thanks for the input.

You didn't mention diffusion/barrier layers and films for prevention of copper migration/diffusion. Did your Motorola contacts describe this?

Re: 2 nS SRAMs for Intel - that would make them 500 MHz devices. I thought Intel was going to build their own L2 SRAM devices for the full speed L2 cache Pentium IIs.

Paul


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