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To: Skeeter Bug who wrote (32794)	5/4/1998 8:30:00 AM
From: Lucretius	Respond to of 53903

Motorola plans 'superfab' site in China By Jack Robertson TIANJIN, China --Motorola Inc. has decided to double the size of a wafer processing facility being constructed here. The company now plans to spend $2.6 billion to turn the site into a "superfab" and a linchpin in its Asian operations, according to sources in China. Details of the unannounced plan appear in the May 1 print edition of Semiconductor Business News. The Tianjin manufacturing complex will contain both high-volume, frontend wafer-fab lines and advanced backend chip-assembly operations. Under the original plan, an 8-inch wafer-processing line is now being built to begin processing devices with 0.5-micron technology in 1999. A new second phase calls for a 0.35-micron fab line to come on line in 2000, doubling the silicon processing capability of the site, according to industry sources. Motorola officials will not yet discuss their Tianjin plans but the sources said the company has decided to concentrate its manufacturing muscle in Asia at the site. In doing so, Motorola's Semiconductor Products Sector has decided to not pursue a number of fab projects in Asia, and instead it will concentrate on a greatly expanded Tianjin facility. With the expanded plans, Tianjin is being added to Motorola's superfab sites in Phoenix, Ariz., Austin, Tex., and West Creek, Va. The Tianjin complex will include a state-of-the-art packaging operation with ball-grid array (BGA) assembly capability. The assembly line is expected to be China's first BGA plant, according to sources.