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To: Mark Johnson who wrote (55197)	5/6/1998 11:12:00 PM
From: Paul Engel	Read Replies (2) \| Respond to of 186894

Mark - Re: " KLIC and AMAT to directly benefit from this?" KLIC makes assembly equipment. Since the 0.18 micron process will continue Intel's push into C4 solder bump technology - and KLIC does not yet provide the flip chip bonders for Intel - KLIC will not benefit. The 0.18 micron process will use 6 layers of Al-Cu with Ti and TiN films, as well as Step-and-Scan wafer steppers for the high resolution 0.18 micron layers. So, I'd guess that the stepper/scanner vendors - particularly SVGL (and maybe Cymer for the laser source) - will benefit. I don't know if Nikon has yet caught up to SVGL. Providers of sputter equipment and CMP equipment and etch equipment - that can handle the fine geometries wil also benefit. IPEC may be one of these CMP suppliers and AMAT, I believe, used to sell Al-alloy sputter deposition/cluster machines to Intel. Paul