To: SemiBull who wrote (2972 ) 5/7/1998 12:29:00 AM From: Paul Moerman Read Replies (2) | Respond to of 3736
Following was on Business Wire today with a time stamp of 4:31P.M. Maybe it will do us some good tomorrow? ----snip--- New Vice President of CMP Process Technology Joins SpeedFam CHANDLER, Ariz.--SpeedFam International, Inc. (NASDAQ:SFAM), a leading supplier of high-throughput chemical mechanical planarization (CMP) systems for the semiconductor industry, as well as flat surface processing systems for the thin film memory disk media and silicon wafer industries worldwide, today announced the appointment of Dr. Mike Heemok Park as vice president of process technology for its semiconductor group. In his new position with SpeedFam, Dr. Park will oversee the Company's CMP process development teams, working closely with customers in the semiconductor device industry. He will also have primary responsibility for enhancing SpeedFam's extensive CMP research and development effort. Dr. Park, a 14-year veteran of the semiconductor industry and formerly with Samsung Company in Seoul, Korea, brings technical engineering experience from such industry leaders as Novellus Systems, Intel Corporation and Hewlett-Packard. Dr. Park's various positions included responsibilities for microprocessor technology transfer for high-volume production, CMP tool concept and feasibility studies, and quality and reliability methodology implementation. A publisher of numerous academic and industry technical papers, Dr. Park brings to SpeedFam an extensive knowledge in both memory and logic process technology. Dr. Park received his Ph.D. from Duke University in materials science in 1983, a master of science degree from Stanford University in operations research in 1984, and a bachelor of science degree from Duke University in biomedical engineering in 1978. "In addition to his leadership and technical capabilities in CMP technology development, Dr. Park's strong customer-focused background will significantly benefit the Company," said Makoto Kouzuma, president and chief executive officer of SpeedFam International. "This customer-based knowledge, combined with our technology and process capabilities, will be invaluable in providing innovative customer-oriented solutions and exceptional production equipment that continue to meet the increasingly stringent requirements of our customers." The Company SpeedFam International, Inc. designs, develops, manufactures, markets and supports chemical mechanical planarization (CMP) systems used in the fabrication of semiconductor devices and other high-throughput precision surface processing systems. SpeedFam's flat surface processing systems are also used in the thin film memory disk media, silicon wafer and general industrial components markets. In addition, the Company markets and distributes polishing liquids (slurries), parts and expendables used in its customers' manufacturing processes. SpeedFam International, Inc. owns a 50-percent interest in each of two joint ventures, SpeedFam Co., Ltd. (the Far East Joint Venture) and Fujimi Corporation. Certain statements in this news release constitute 'forward-looking statements' within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. The aforementioned risks, uncertainties and other factors are discussed in the Company's filings with the Securities and Exchange Commission (SEC). CONTACT: SpeedFam International, Inc. Roger K. Marach, 602/705-2100 (Chief Financial Officer) Karen A. Silva, 602/705-2113 (Manager, Investor Relations) "Copyright(c) 1998, Business Wire" "Provided by Dow Jones & Company, Inc."