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To: Dale Knipschield who wrote (13839)	5/14/1998 9:41:00 AM
From: Tech Master	Respond to of 17305

Thursday May 14, 7:00 am Eastern Time Company Press Release SOURCE: Irvine Sensors Corporation Irvine Sensors Division Announces New Stacked-Chip Products Ball-Grid-Array Packages Cover Additional Market Segments COSTA MESA, Calif., May 14 /PRNewswire/ -- Irvine Sensors Corporation (Nasdaq: IRSN, Boston: ISC) announced today that its Microelectronics Products Division (MPD) has started to quote price and schedule availability for ceramic (hermetic) and polyimide (plastic/non-hermetic) chip-stacks which utilize ball-grid-array (BGA) attachment techniques. Such techniques permit high input-output counts and mixed-chip stacks. Polyimide BGA stacks are believed to be particularly appropriate to the increasingly dense packaging requirements of hand-held electronic devices such as cellular phones and palm top computers. Ceramic BGAs, with their increased level of physical protection, are useful for avionics, military, space, and rugged environment applications. The BGA stacks complement Irvine Sensors' historical ultra-high-density stacks and the Thin Small Outline Package (TSOP) stacks previously announced by MPD, and provide the Company with a proprietary product line that can address a wide range of customer density and price requirements for dense electronic packages. The new products are the subject of patents pending which will add to Irvine Sensors' already extensive patent portfolio. Floyd K. Eide, Irvine Sensors' Vice President and MPD General Manager, said, ''MPD is organized to be very responsive to the needs of its customers. We tailor devices that are customer-unique and application-specific. To provide rapid time-to-market and to avoid excess inventory, our TSOP products have been built using an external network of production suppliers. Our BGA products are designed to be built the same way.'' Irvine Sensors is presently realizing revenues from the two ends of the stacked-product spectrum, ranging from ultra-dense, stacked multi-chip assemblies for a Boeing wearable computer development to relatively inexpensive TSOP stacks for a flight test program. Deliveries under MPD's first stacked-TSOP order, an approximate $400,000 contract announced five months ago, have begun and are expected to be completed by the end of the current quarter. For product and sales information, contact Larry Bradfield, Irvine Sensors' National Sales Manager, at larryb@irvine-sensors.com, Phone 1-714- 444-8763, or FAX 1-714-444-8840. Irvine Sensors Corporation (www.irvine-sensors.com), headquartered in Costa Mesa, California, is primarily engaged in the development and sale of high density electronics, micro sensors and sensor readout circuits, digital imaging and image processing devices, wireless infrared communications products, and low-power analog integrated circuits for diverse systems applications. Except for historical information contained herein, the matters set forth in this press release are forward-looking statements that are dependent on risks and uncertainties including such factors, among others, as the dependence of the Company on external sources of supply and the impact of competition. The Company undertakes no obligation to publicly release the results of any revision to these forward-looking statements that may be made to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. Further information on the Company's status and the matters discussed herein are contained in publicly-filed disclosures available through the SEC's EDGAR data base (www.sec.gov) or the Company's Shareholder Relations. SOURCE: Irvine Sensors Corporation

To: Dale Knipschield who wrote (13839)	5/14/1998 11:53:00 AM
From: Andrew Vance	Read Replies (2) \| Respond to of 17305

AV--You aren't the only one who is positioned in cash waiting for either a bottom or signs of the next positive flurry in stock appreciation. I am dabbling here and there but have some nice reserves just aching to be placed at the right time. From what I have read this morning on SS, I may reconsider the exit point of the defensive shares. I guess as long as ALYD moves in the correct direct and I have additional funds, I should let the winners run a trifle longer. With my luck, ALYD will peak while I am incognito.<GGG> Andrew