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To: Andy M. who wrote (12387)	5/15/1998 10:45:00 AM
From: shane forbes	Respond to of 25814

Andy: That is a good point. But remember we had no reaction to the GSM announcement, nothing to the FC core (this was 1996 I think!), not much to subsequent DCAM announcements (first few were interesting and elicited interest). On the $20 per chip check out the LSI NEWS ONLY thread. There are 2 articles on the DTT chip - check the 2nd one out - it is near the bottom of the page. The 200 million is the number of households currently using antennas or something like that. The point is that there will likely be a nice good sized market for the DTT chip - one would hope LSI could be easily pumping out 5-10 million of these chips out sometime in the next 2 years. That is another $100-200 million in annual revenue. Another Horseman is born! Shane.

To: Andy M. who wrote (12387)	5/16/1998 2:18:00 AM
From: shane forbes	Read Replies (2) \| Respond to of 25814

Andy: I just wanted to point out that the DTT chip will also be used in TVs. Also they said they were shipping to lead customers. Also I think DTT must begin this year in Europe (don't quote me) Now your eyes can light up. I pay no attention to the market's reaction - LSI is too big and too diversified and in the big-time dog-house for one chip with maybe no more than $10-$20 million in revenues this year (if that). ---- Tidbit (LSI involved pretty heavily in DVB chips - check the "plan" out - from LSI Web Site - so they did have a chip for cable...): The LSI Logic Consumer Products Division has defined the DVB line of products as strategic. In the last few years, LSI Logic has developed and successfully put on the market a variety of satellite (L64706, L64705, L64704, L64724) and cable (L9A0054, L64768) chips, as well as transport de-multiplexing and CPU components (L64007, L64008), and MPEG2 decoders (L64002, L64005). Digital terrestrial solutions are the third family of front end chips, of which the L64780 is the first element. LSI Logic will continue on the way of integration toward a single chip including ADC, COFDM demodulation and FEC. ----- Shane.