irsn.....looks more solid than xybr. even wonder if xybr may use irsn technology.
Former Irvine Sensors Corporate Executive Joins Dense-Pac Microsystems Inc.
GARDEN GROVE, Calif.--(BUSINESS WIRE)--May 11, 1998--
Dense-Pac Microsystems Expands Sales to Commercial Space
Communication Agencies With an Addition of a New Memory Expert
Dense-Pac Microsystems Inc. (Nasdaq:DPAC) Monday announced that David Castrucci has joined the company as vice president of sales and strategic development for the commercial space telecommunication and government divisions.
Castrucci will establish an operation out of Burlington, Vt., to further strengthen Dense-Pac's high-density technology into the government and military marketplace.
Prior to joining Dense-Pac, Castrucci was president of Professional Sales Associates ("PSA") which was a memory consulting firm specializing in high-density memory and systems electronics for space, military, and high-end commercial applications. PSA's clients included NASA, Cray Research, TRW, Seaker Engineering, and Silcon Graphics. Previously, Castrucci was director of sales, marketing and business development at Irvine Sensors Corp.-CPO (Nasdaq:IRSN). Prior to Irvine Sensors, Castrucci held various positions in the semiconductor electronics markets.
Castrucci stated: "I was impressed with Dense-Pac's recent technology advancements, versatility of the three-dimensional product line, and the high-energy and sophistication of the management team. I have been working in the stacked memory market for five years on several technologies, including multichip modules and stacked commercial components.
"Dense-Pac's technology is, in my opinion, the most advanced automated and cost effective design and is becoming one of the leading technology suppliers into specialized fields. The technology allows quick-turn automated and low-cost production, high density, constant footprint and pin out for long life board designs and the needed ability to stack mixed ICs and BGA packages."
Uri Levy, chairman and chief executive officer of Dense-Pac, commented: "We are pleased to have David join the Dense-Pac team. His background lends itself to our current needs of the introduction of Dense-Pac's new high-density products into commercial space telecommunication projects. We have not previously targeted these specific government and space applications. David has already demonstrated his successes in preliminary penetration in these markets with Dense-Pac products."
Dense-Pac Microsystems designs and manufactures proprietary and patented three-dimensional high-density memory products enabling the company's commercial, industrial and military customers to stack large amounts of memory into small spaces. To learn more about the company, visit Dense-Pac's Web site at www.dense-pac.com. -0-
The above statements are forward-looking statements and projections (including statements concerning plans and objectives of management for future operations and statements concerning earnings expectations) are based on management's belief as well as assumptions made by, and information available to management. Although management believes that its expectations are based on reasonable assumptions, there can be no assurances that the company's financial goals will be realized. Numerous factors may effect the company's actual results and may cause results to differ materially from those expressed in forward-looking statements made by or on behalf of the company.
Some of these factors include, without limitation, demand and acceptance of new and existing products, technological advances and product obsolescence, availability of semiconductor devices at reasonable prices, competitive factors and the availability of capital to finance growth. These and other risks are discussed in greater detail in the company's filings with the Securities and Exchange Commission.
CONTACT:
Dense-Pac Microsystems Inc., Garden Grove
William M. Stowell, CFO
714/898-0007
Web site: www.dense-pac.com
KEYWORD: CALIFORNIA
BW1092 MAY 11,1998
Irvine Sensors Division Announces New Stacked-Chip Products
Ball-Grid-Array Packages Cover Additional Market Segments
COSTA MESA, Calif., May 14 /PRNewswire/ -- Irvine Sensors Corporation (Nasdaq: IRSN, Boston: ISC) announced today that its Microelectronics Products Division (MPD) has started to quote price and schedule availability for ceramic (hermetic) and polyimide (plastic/non-hermetic) chip-stacks which utilize ball-grid-array (BGA) attachment techniques. Such techniques permit high input-output counts and mixed-chip stacks. Polyimide BGA stacks are believed to be particularly appropriate to the increasingly dense packaging requirements of hand-held electronic devices such as cellular phones and palm top computers. Ceramic BGAs, with their increased level of physical protection, are useful for avionics, military, space, and rugged environment applications.
The BGA stacks complement Irvine Sensors' historical ultra-high-density stacks and the Thin Small Outline Package (TSOP) stacks previously announced by MPD, and provide the Company with a proprietary product line that can address a wide range of customer density and price requirements for dense electronic packages. The new products are the subject of patents pending which will add to Irvine Sensors' already extensive patent portfolio.
Floyd K. Eide, Irvine Sensors' Vice President and MPD General Manager, said, "MPD is organized to be very responsive to the needs of its customers. We tailor devices that are customer-unique and application-specific. To provide rapid time-to-market and to avoid excess inventory, our TSOP products have been built using an external network of production suppliers. Our BGA products are designed to be built the same way."
Irvine Sensors is presently realizing revenues from the two ends of the stacked-product spectrum, ranging from ultra-dense, stacked multi-chip assemblies for a Boeing wearable computer development to relatively inexpensive TSOP stacks for a flight test program. Deliveries under MPD's first stacked-TSOP order, an approximate $400,000 contract announced five months ago, have begun and are expected to be completed by the end of the current quarter.
For product and sales information, contact Larry Bradfield, Irvine Sensors' National Sales Manager, at larryb@irvine-sensors.com, Phone 1-714- 444-8763, or FAX 1-714-444-8840.
Irvine Sensors Corporation (www.irvine-sensors.com), headquartered in Costa Mesa, California, is primarily engaged in the development and sale of high density electronics, micro sensors and sensor readout circuits, digital imaging and image processing devices, wireless infrared communications products, and low-power analog integrated circuits for diverse systems applications.
Except for historical information contained herein, the matters set forth in this press release are forward-looking statements that are dependent on risks and uncertainties including such factors, among others, as the dependence of the Company on external sources of supply and the impact of competition. The Company undertakes no obligation to publicly release the results of any revision to these forward-looking statements that may be made to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. Further information on the Company's status and the matters discussed herein are contained in publicly-filed disclosures available through the SEC's EDGAR data base (www.sec.gov) or the Company's Shareholder Relations.
SOURCE Irvine Sensors Corporation
CO: Irvine Sensors Corporation
ST: California
IN: CPR
SU: PDT
05/14/98 07:06 EDT prnewswire.com
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