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To: Zeev Hed who wrote (17513)	5/16/1998 10:55:00 AM
From: BillyG	Respond to of 25960

TSMC is moving to .18 micron early in 1999. pubs.cmpnet.com TSMC plans 0.18-micron in early '99 and discloses copper in new roadmap By Mark LaPedus Electronic Buyers' News SAN JOSE-- Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has officially rolled out its technology roapmap, announcing plans to offer a copper-metalization process while also becoming one of the world's first chip makers to move to 0.18-micron production by early 1999. Hsinchu-based TSMC, the world's largest pure-play, IC-wafer foundry company, has taken an ambitious, quantum leap during the last several years, jumping from process technologies of 0.8-micron in the early 1990s, to 0.35-micron and below in 1997. "We're in the process of ramping up our 0.25-micron process technology right now,'' according to Ron Norris, president of TSMC's U.S. subsidiary, based in San Jose. ''We will be 0.18-micron by the end of the first quarter of next year.'' Speaking at a press event in San Jose this week, Norris said TSMC will continue to advance its foundry-based logic, mixed-signal, and embedded memory businesses. In the logic and memory arenas in 1999, for example, TSMC plans to offer to its foundry customers a 0.18-micron process technology at 1.8- to 3.3-v. Another surprise is TSMC's move into the copper-metalization arena, a move that would give its foundry customers a major boost.