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To: shane forbes who wrote (12480)	5/18/1998 9:55:00 AM
From: Grand Poobah	Read Replies (1) \| Respond to of 25814

I thought the article on copper was a bit overdramatic about the problems. LSI will have more and more reason to implement it within probably a year or so. Their next (as yet unannounced) 0.13-micron process will almost surely use copper, and I wouldn't be surprised if they will also implement Cu in the 0.18-micron G12 process at some point in the not too distant future. The speed advantage for a process using Cu interconnects and low-k dielectrics over Al and SiO2 goes something like this: 0.35-micron process: Cu is 1.2 times faster 0.25-micron process: Cu is 1.4 times faster 0.18-micron process: Cu is 2.0 times faster 0.13-micron process: Cu is 2.6 times faster In actuality Al interconnects are getting slower as the size decreases, and the speed of Cu interconnects is staying pretty constant, thus the advantage for Cu. So you can see LSI has good motivation to implement Cu pretty soon. Of course, there are obstacles, so Shane's estimate of a few quarters is probably right. G.P.