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To: Ian@SI who wrote (5614)	5/31/1998 12:50:00 PM
From: Ian@SI	Respond to of 10921

To thread, From an EBN story, it appears that the same number of 256Mb die can be produced on a 200mm wafer by reducing the feature size to .20æm. Unless .20æm yields are expected to be permanently impaired, it's very difficult to understand Carl Johnson's premise that DRAM makers can't make money prior to 300mm with 256Mb chips. Any insights would be appreciated. Ian. The new generation has an important advantage. Initially, some of the new 256-Mbit chips will be the same size as the current 64-Mbit units, enabling them to fit into existing DIMMs and SIMMs. To accomplish this, the early producers of 256-Mbit chips will use 0.2-micron feature sizes and move to 0.18 micron as quickly as possible. Having the next-generation DRAM in the current module package could give an early boost to high-end server OEMs with insatiable appetites for memory. Whole story is available at: pubs.cmpnet.com