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Technology Stocks : Kulicke and Soffa -- Ignore unavailable to you. Want to Upgrade?

To: William Nelson who wrote (2910)	6/2/1998 1:10:00 AM
From: bob oserin	Respond to of 5482

Gee, Bill, I think Scott K. could answer that question. Give him a call. BOB O

To: William Nelson who wrote (2910)	6/2/1998 6:11:00 AM
From: GarryP	Read Replies (1) \| Respond to of 5482

William , What you are referring to is either Ball Grid Array packaging where the final package uses balls to form the interconnection with the PCB or you are referring to flip chip technology where the balls are attached to the silicon chip and the chip is then attached to either the PCB or to an interposer board which is then mounted to the mother PCB . Whichever you are referring to then this is not an issue for KLIC as : 1. BGA;s still uses wire bonding 2. Flip chip will be a very small area of production for the coming few years ( despite what analysts are saying ), KLIC have equipment AND production capacity for this ( through Flip Chip Technology - IF it still exists ) Regards , GaryP