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To: pat mudge who wrote (17969)	6/4/1998 6:10:00 AM
From: H James Morris	Read Replies (1) \| Respond to of 25960

This should cheer up Curley and Aloha. <NEC Confirms U.S. 300-mm Wafer Fab Plans (06/02/98; 2:50 p.m. ET) By Staff, Semiconductor Business News NEC officially confirmed it plans to invest $1.4 billion to build and equip a 300-mm wafer fab in Roseville, Calif., which is slated to become operational in 2002. The fab is expected to produce 256-megabit and 1-gigabit dynamic RAMs, in addition to eventually supporting system-on-a-chip product offerings in the next century. Last week, sources said NEC [NIPNY] was preparing to announce the California fab, and it was reportedly planning another 300-mm wafer processing plant in Japan. The new Roseville facility will be located adjacent to NEC's existing wafer fab. Under the current plan, the fab will be equipped to produce chips with 0.15-micron process technology. While NEC has set its initial targets for the plant, the company said it will closely gauge changing conditions and directions in the chip industry during the next couple of years before locking in its final plans for the 300-mm fab. NEC said the new production line is expected to produce 20,000 wafers per month and create about 700 new jobs in Roseville. "The Roseville facility has become one of the most productive NEC plants in the world and we expect to experience the same level of success with more advanced products from the new facility," said Hajime Sasaki, senior executive vice president of NEC.