North American Semiconductor Equipment Industry Posts May 1998
Book-to-Bill Ratio of 0.80
MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--June 16, 1998--The North
American semiconductor equipment industry posted a book-to-bill ratio
of 0.80 for May 1998, it was reported by Semiconductor Equipment and
Materials International (SEMI).
A book-to-bill of 0.80 means $80 in orders were received for each
$100 worth of products shipped.
Three-month average shipments in May 1998 were $1.4 billion. The
figure is about even with the April 1998 level, and is 18 percent
above the May 1997 level. Three-month average bookings increased in
May 1998 to $1.1 billion. The bookings figure is four percent above
the April 1998 level, and 14 percent below the May 1997 level.
"The recent decline in orders appears to have leveled off," said
Dick Greene, principal analyst with SEMI. "The bookings numbers for
May are improved, however we should bear in mind that they are still
33 percent below the Nov. 1997 peak. We should expect to see the
underlying numbers continue to move closer to parity while remaining
off of the high mark of last year."
The SEMI book-to-bill is a ratio of three-month moving average
bookings to three-month moving average shipments. Shipments and
bookings figures are in millions of U.S. dollars.
*T
Month Shipments Bookings Book-to-Bill
December 97 1,559.3 1,550.3 0.99
January 98 1,458.0 1,363.6 0.94
February 98 1,369.1 1,233.5 0.90
March 98 (final) 1,370.3 1,123.1 0.82
April 98 (revised) 1,366.9 1,054.0 0.77
May 98 (preliminary) 1,365.7 1,092.5 0.80
0-
The data contained in this release was compiled by the
independent public accounting firm of Arthur Andersen LLP, without
audit, from data submitted directly by the participants. SEMI and
Arthur Andersen LLP can assume no responsibility for the accuracy of
the underlying data.
The data are contained in a monthly Express Report published by
SEMI that tracks shipments and orders for equipment used to
manufacture semiconductor devices, not shipments and orders of the
chips themselves.
Based in Mountain View, SEMI is an international trade
association serving more than 2,200 companies participating in the $65
billion semiconductor and flat panel display equipment and materials
markets. SEMI maintains offices in Austin, Beijing, Boston, Brussels,
Hsinchu, Moscow, Seoul, Singapore, Tokyo and Washington, D.C. Visit
SEMI OnLine at www.semi.org.
CONTACT:
SEMI
Jonathan Davis, 650/940-6937
jdavis@semi.org
or
Ruder-Finn, Inc.
Renee Martin, 212/593-5859
martinr@ruderfinn.com
KEYWORD: CALIFORNIA MASSACHUSETTS DISTRICT OF COLUMBIA
BW0510 JUN 16,1998
------
Japanese Chipmaking-Equipment Orders Fell 42% in April on Year
Tokyo, June 17 (Bloomberg) -- Worldwide orders for microchip-
making equipment made in Japan fell 42.1 percent in April from
the same month a year earlier to 66.7 billion yen ($466 million),
the Semiconductor Equipment Association of Japan said.
That's the fifth straight month of decline, indicating
weaker demand for equipment, especially from Japanese and South
Korean semiconductor makers. The slowdown is hurting the bottom
lines of Japan's largest makers of chip-producing equipment, such
as Tokyo Electron Ltd., Canon Inc., Nikon Corp. and Advantest
Corp.
Worldwide sales of Japanese semiconductor-making equipment,
however, rose in April for the ninth straight month. Global sales
increased 0.1 percent in April from a year earlier to 72.3
billion yen, the association said.
Sales tend to lag orders by several months to half a year.
Japanese demand for semiconductor-making equipment,
including orders of equipment made overseas, fell 41.9 percent in
April to 41.4 billion yen, the fourth straight month of decline.
Sales in Japan of equipment made by Japanese and overseas
companies rose 10.2 percent to 42.0 billion yen, the association
said.
The following tables break down global and domestic orders
and sales of semiconductor-making equipment manufactured in
Japan.
Global orders for chipmaking equipment made in Japan:
***********************************************************
Apr. Y-o-Y
(mln of yen) Change
************************************************************
Mask/Reticle Man. Eqpt. 788 22.9%
Wafer Man. Equip. 263 -90.6%
Wafer Processing Equip. 41,963 -42.9%
Assembly Equipment 5,337 -40.2%
Inspection Equip. 16,003 -36.6%
Related Equipment 2,312 -43.0%
************************************************************
Total 66,696 -42.1%
************************************************************
Global sales of Japanese chipmaking equipment:
************************************************************
Apr. Y-o-Y
(mln of yen) Change
************************************************************
Mask/Reticle Man. Equip. 618 -44.3%
Wafer Man. Equip. 222 -88.5%
Wafer Processing Equip. 45,341 7.5%
Assembly Equipment 5,883 0.1%
Inspection Equip 17,193 -5.9%
Related Equipment 3,059 7.0%
************************************************************
Total 72,316 0.1%
************************************************************
Domestic orders of chipmaking equipment:
************************************************************
Apr. Y-o-Y
(mln of yen) Change
************************************************************
Mask/Reticle Man. Equip. 190 -60.9%
Wafer Man. Equip. 441 -81.9%
Wafer Processing Equip. 28,864 -39.7%
Assembly Equipment 2,633 -40.2%
Inspection Equip 7,875 -34.5%
Related Equipment 1,262 -68.9%
************************************************************
Total 41,429 -41.9%
************************************************************
Domestic sales of chipmaking equipment:
************************************************************
Apr. Y-o-Y
(mln of yen) Change
************************************************************
Mask/Reticle Man. Equip. 607 -39.8%
Wafer Man. Equip. 409 -74.2%
Wafer Processing Equip. 28,619 16.6%
Assembly Equipment 2,920 11.9%
Inspection Equip 6,582 4.9%
Related Equipment 2,721 28.7%
************************************************************
Total 42,041 10.2%
***********************************************************
20:21:29 06/16/1998
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