To: RetiredNow who wrote (4740 ) 6/22/1998 2:18:00 PM From: Barry Grossman Respond to of 93625
Thread, More news: IRVINE, Calif., June 12 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC) today announced that Toshiba's 72 megabit (Mb) Direct Rambus DRAM (RDRAM) devices are the industry's first with confirmed 800 megahertz (MHz) or 1.6 gigabytes per second (GB/s) functionality. In another first, Toshiba delivered samples this week which are now undergoing system testing and chipset validation. "Rambus Inc. (Nasdaq: RMBS) has confirmed that our 72Mb Direct RDRAM devices were first to complete functional tests, including pipelined read/write operations at speed, initialization procedures and power management operations," said Jamie Stitt, manager, DRAM marketing at TAEC. "In fact," he continued, "based on our characterization results, our first parts achieved better than 2GB/s bandwidth. With plenty of margin at such an early stage, we're confident we can ramp production to meet the industry's needs in 1999." The devices are manufactured using Toshiba's 0.25 micron process technology. "Propelled by our front-runner position in Direct RDRAM and our PC100 leadership in 64Mb SDRAM, we are on track to capture the prime PC/server main memory position by year end," said Stephen Marlow, vice president, memory operations at TAEC. "We've aligned our strategy with our customers' memory requirements, our process roadmap is cutting edge and we've made all the upfront technology investments." In February 1998, Rambus completed the Direct RDRAM interface design and distributed it simultaneously to all of the company's DRAM licensees. In April, just two months later, Toshiba was the first in the industry to achieve working first silicon. Toshiba expects to begin general customer sampling in September 1998 with mass production slated for the first quarter of 1999. Pricing has not been established. Toshiba was among the first semiconductor manufacturers to license Rambus technology. TAEC demonstrated the industry's first RDRAM working silicon in June 1992 and followed with the first Rambus-based multimedia systems using Toshiba RDRAMs and ASICs in 1993. Key Specifications: Chip size 107mm2 Organization 4M word x 18 bits Page size 1Kbytes Data Transfer Speed 800MHz max. (1.6GB/s) Voltage 2.5V Power Consumption Operating: 2,200mW Standby: 260mW NAP mode: 10mW Refresh cycle 8K cycles/32ms Package CSP Toshiba America Electronic Components, Inc. (TAEC) is the North American design, manufacturing, marketing and sales arm of Toshiba Corporation, one of the world's largest suppliers of semiconductors, integrated circuits and electronic components. TAEC offers one of the broadest IC product lines in the industry as well as technologically-advanced electron tubes and solid state devices, including color picture tubes, color display tubes, liquid crystal displays, rechargeable batteries, microwave components, laser diodes and optical transmission devices. In addition to its comprehensive offering of high quality components, the company markets a wide range of industry standard 2.5-inch hard disk drives, CD-ROM drives and DVD-ROM drives. The company is located at 9775 Toledo Way, Irvine, CA 92618-1811. For more company information, please visit TAEC's Internet home page at: toshiba.com . Rambus and RDRAM are registered trademarks of Rambus Inc. Direct Rambus and Direct RDRAM are trademarks of Rambus Inc. SOURCE Toshiba America Electronic Components, Inc. /NOTE TO EDITORS: Reader inquiries please publish 800-879-4963. Die photo and package photo are available as JPEG files via e-mail; please call Sonia Solanki at 714-553-1177./ /CONTACT: Annette Birkett of Toshiba America Electronic Components, Inc., 714-455-2298 (not for reader inquiries); Reader inquiries: 800-879-4963; or Agency: Judith G. Kahn or Rick Sharga, 800-503-1177, both of Shafer Public Relations/ /Web site: toshiba.com