AMCC'S Gigabit Ethernet Chipset Selected by 3Com for Use
in SuperStack II Hub 1000 SX - BW, 08:17 a.m. Jun 29, 1998 Eastern
Industry-Leading Transceivers Enable High-Speed Serial Data
Transmission in Full-Duplex Gigabit Ethernet Repeater
SAN DIEGO--(BUSINESS WIRE)--June 29, 1998--
Applied Micro Circuits Corp. (AMCC) (NASDAQ:AMCC), a leader in
high-bandwidth silicon connectivity solutions, today announced that 3Com Corp.
has selected AMCC's S2046 and S2047 Gigabit Ethernet transmitter and receiver
pair for use in the company's new SuperStack(R) II Hub 1000 SX, an 8-port
repeater.
Using AMCC's S2046/S2047 chipset, the SuperStack II Hub 1000 SX is capable of
simultaneously sending and receiving information at rates of 1000 Mbps, as well as
forwarding all incoming packets to all ports on the hub in full compliance with the
proposed IEEE 802.3z specification.
AMCC's IEEE 802.3z-compliant Gigabit Ethernet transmitter and receiver pair was
selected for use in the 3Com application based on its superior combination of price,
jitter performance, and power consumption. With 1250 Mbps operation over fiber
optic or coaxial cable interfaces, the S2046 and S2047 easily meets the high-speed
data communications requirements of the SuperStack II Hub 1000 SX, while
offering its designers a compact 52 PQFP package to work with.
The S2046/47 chipset's low-power design paved the way for 3Com's development
of a power-conscious product. Further, the chipset's low jitter output enabled the
company's design engineers to more easily meet overall system jitter requirements.
"The SuperStack II Hub 1000 SX delivers a low cost solution to IS Managers
seeking to increase signal transmission by combining the cost advantages of a hub
with the full-duplex capability of a switch," said Sung-Min Tao, Senior Product
Manager, Advanced Products Division for 3Com Corp. "We selected AMCC's
chipsets because their superior jitter characteristics, excellent performance and low
cost fit well within our pricing and product design goals for the new SuperStack II
Hub 1000 SX."
"This latest integration speaks of the quality, performance, and cost benefits 3Com
has reaped from past integration with AMCC's components." said Jack Basi,
AMCC's director of marketing for datacom and computer products. "We look
forward to leveraging the functionality of our devices in future 3Com quality
networking solutions, while strengthening our relationship with the company."
The SuperStack II Hub 1000 SX is guaranteed to be fully compliant with the final
IEEE 802.3z specification, providing a ready path to future Gigabit Ethernet
migrations. The new repeater also offers packet flow control to ensure that
transmitted data remains intact from origin to destination, ultimately reducing packet
loss and eliminating the need for packet re-transmission. The SuperStack II Hub
1000 SX is designed to meet multiple networking requirements including use as a
server aggregator, switch aggregator, concentrator, or within workgroups.
AMCC's chipset performs parallel-to-serial and serial-to-parallel conversion,
framing for block-ended data, Fibre Channel framing, and offers a 10- or 20-bit
parallel TTL compatible interface. The S2046 on-chip PLL synthesizes the
high-speed clock from a low-speed reference, while the S2047 on-chip PLL
synchronizes directly to incoming digital signals, to receive data stream. To minimize
crosstalk and maximize data integrity, the transmitter and receiver each support
differential PECL-compatible I/O for fiber optic component interfaces. With only 1
watt typical power dissipation for chipset, and I/O power supply requirements of
+3.3/+5V, AMCC's transmitter and receiver pair offers optimal data throughput
and peak efficiency.
The chipset also features local loopback, lock detect, and continuous downstream
clocking from receiver to ensure data integrity. The S2046 and S2047 lends speed
and performance to applications such as Ethernet backbone connections,
mainframes, frame buffers, switched networks, data broadcast environments,
proprietary extended backplanes, etc.
AMCC is a premier supplier of high-bandwidth silicon connectivity for the world's
communication infrastructure. The company utilizes its world class expertise in
mixed-signal design and multiple silicon process technologies to provide high
performance silicon solutions for SONET, ATM, Gigabit Ethernet and Fibre
Channel markets. AMCC's core technologies also address ATE and high-speed
computing needs.
AMCC's corporate headquarters and wafer fabrication facilities are located in San
Diego. Sales and consulting engineering offices are located throughout the world.
For further information regarding AMCC and its products, write: Marketing
Communication Department, AMCC, 6290 Sequence Drive, San Diego, Calif.
92121-4358; or call 800-755-AMCC (800/755-2622) or 619/450-9333; or fax
619/450-9885; or email nwpr@amcc.com; or visit our Web site at
amcc.com.
3Com Corp. enables individuals and organizations worldwide to communicate and
share information and resources at anytime from anywhere. As one of the world's
preeminent suppliers of data, voice and video communications technology, 3Com
has delivered networking solutions to more than 100 million customers worldwide.
The company provides large enterprises, small and medium enterprises, carriers and
network service providers, and consumers comprehensive, innovative information
access products and system solutions for building intelligent, reliable and high
performance local and wide area networks. For further information, visit 3Com's
World Wide Web site at 3com.com or the press site at
http//www.3com.com/pressbox.
Except for historical information contained herein, the matters set forth in this news
release are forward looking statements that are subject to certain risks and
uncertainties that could cause actual results to differ materially from those set forth
in the forward looking statements, including such factors as the rescheduling or
cancellation of orders by customers; fluctuations in the timing and amount of
customer requests for shipments; fluctuations in manufacturing yields and inventory
levels; changes in product mix; the company's ability to introduce new products and
technologies on a timely basis; the introduction of products and technologies by the
company's competitors; the availability of external foundry capacity, purchase parts,
and raw materials; competitive pressures on selling prices, the timing of investments
in research and development; market acceptance of the company's and its
customer's products; the timing of depreciation and other expenses to be incurred
by the company in connection with the expansion of its existing manufacturing
facility and in connection with its proposed new manufacturing facility; the timing
and amount of recruiting and relocation expenses, prototyping costs and promotional
expenses; costs associated with future litigation, if any, including without limitation,
litigation relating to the use or ownership of intellectual property; costs associated
with compliance with applicable environmental regulations; general semiconductor
industry conditions; and general economic conditions, and the risk factors that are
detailed in the Final Prospectus relating to the recent initial public offering of the
company's Common Stock and the company's other filings with the Securities and
Exchange Commission.
Product photos, datasheets and application notes are available upon request.
AMCC is a registered trademark of Applied Micro Circuits Corporation. 3Com
and SuperStack are registered trademarks of 3Com Corporation.
Copyright 1998, Business Wire
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