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Technology Stocks : VLSI Technology - Waiting for good news from NASDAQ !!! -- Ignore unavailable to you. Want to Upgrade?


To: OldAIMGuy who wrote (3739)6/30/1998 8:56:00 AM
From: Linda Kaplan  Respond to of 6565
 
Headline: VLSI VSC9 0.25-micron ASIC Process Fully Operational; VSC10 0.2-micron
Process on Schedule; Copper Interconnect Slated for Next-Generation 0.15-micron
Process

======================================================================
SAN JOSE, Calif.--(BUSINESS WIRE)--June 30, 1998--VLSI
Technology, Inc. (NASDAQ:VLSI) said today that its 0.25-micron (drawn
gate length; 0.18-micron Leffective) VSC9 custom circuit process
technology has passed its stringent qualification requirements in its
San Antonio, Texas fab line and is in full production.
At the same time, the company indicated that development of its
VSC10 0.2-micron (drawn gate length; 0.15-micron Leffective) process
proceeds on schedule, with full production qualification expected in
early Q4 1998.
The company also committed itself to offering copper-based
interconnect technology as an option on its forthcoming VSC11
0.15-micron (drawn gate length) process technology generation.
Rich Beyer, VLSI president and COO, congratulated VLSI's
Technology Development and Manufacturing divisions on bringing the
world's most advanced custom circuit manufacturing technology into the
market mainstream. "Advanced process technology lets our customers
pack more functionality into physically smaller, less expensive
circuits than ever before. This is a competitive advantage in itself,
but only part of the complete value proposition that VLSI brings to
the custom silicon market.
"As a full-service custom silicon supplier, we offer extensive
off-the-shelf core and circuit block libraries; advanced,
time-to-market efficient design methodologies; quick-turn, high-flex
manufacturing; application-tuned packaging; and outstanding customer
service. In short, we deliver a chain of value-added services at every
phase of the custom circuit development process."

Copper Interconnect Roadmap

VLSI also previewed its copper interconnect strategy for its
forthcoming 0.15-micron (drawn) process technology generation. Based
on extensive simulation of circuit performance, VLSI sees copper
interconnect as providing performance advantages for relatively long
inter-block connections at very deep submicron process generations.
VLSI plans to deploy copper for the upper layers of interconnect
(Metal 4 and Metal 5) of its next-generation VSC11 process, which will
come on line in 1999.
Rajeeva Lahri, VLSI vice president of corporate technology
commented: "Offering copper interconnect in 1999 keeps pace with the
rest of the industry. The industry's migration to it will be paced by
deliveries of copper-capable production systems from semiconductor
process equipment manufacturers.
"Our research shows that copper will provide a significant
performance boost at the upper layers of interconnect. VLSI's plan for
introducing copper in manufacturing reflects the reality of capital
equipment delivery schedules and VLSI's long-standing commitment to
provide the most cost effective solution to customers needs."
VLSI plans to release full details of its VSC11 deep submicron
custom silicon manufacturing process this autumn, including a full
development schedule. For technical information on VLSI's copper
integration migration programs, readers should contact VLSI's Dipu
Pramanik, director of process technology, on dipu.pramanik@vlsi.com.

About VLSI Technology, Inc.

VLSI Technology, Inc. designs and manufactures System-Level
Silicon(TM) integrated circuits based on its FSB(tm) functional system
blocks library. Targeting its offerings toward the wireless
communications, networking, consumer digital entertainment and
computing markets, the company offers its customers advanced
system-level integration capabilities.
The company is based in San Jose, California, with 1997 revenues
from continuing operations of $712.7 million, and approximately 2,500
employees worldwide. Visit VLSI's homepage at vlsi.com.

Note to Editors: FSB, functional system block, and System-Level
Silicon are trademarks of VLSI Technology, Inc. All other brand or
product names are trademarks and/or registered trademarks of their
respective owners.

CONTACT: VLSI Technology, Inc
Martin Chorich, 408/922-5155 (Media Inquiries)
martin.chorich@sanjose.vlsi.com

KEYWORD: CALIFORNIA
INDUSTRY KEYWORD: COMPUTERS/ELECTRONICS COMED PRODUCT
KEY: VLSIFX
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