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To: wmf who wrote (9103)7/7/1998 2:10:00 PM
From: Scumbria  Read Replies (2) | Respond to of 11555
 
there is not much of an intrinsic die area benefit to the "system-on-a-chip" technology except maybe some bond pads.

The packaging and testing costs of chips is beginning to exceed the manufacturing costs of the dies. By incorporating several individual chips into one piece of silicon, the total packaging/testing cost is greatly reduced.

Scumbria


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