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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Jim McMannis who wrote (34050)7/8/1998 4:40:00 PM
From: Time Traveler  Read Replies (1) | Respond to of 1571690
 
Given the same die foot print, a shrink from 0.35um to 0.25um should yield twice the number of dice on the same size wafer. However, the power handling capability reduces. To get the power handling capability up again, you have to increase the die size by adding more functions to the chip. Hey, both Intel and AMD now are talking about incorporating the L2 cache right onto the silicon.

Time Traveler



To: Jim McMannis who wrote (34050)7/8/1998 4:50:00 PM
From: Dave  Read Replies (2) | Respond to of 1571690
 
Jim:

RE .35 to .25 Die shrink.

The reason why Intel's max. number of dice on the wafer stayed constant was becuase Intel went from the Pentium MMx to the Pentium 2. With the subsequent die shrink from .35 to .25, the area of a Pentium MMx at .35 u is roughly equal to the area of a Pentium 2 at .25.

dave


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