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To: Paul Engel who wrote (59661)7/10/1998 12:37:00 AM
From: Higgs Boson  Read Replies (1) | Respond to of 186894
 
Paul,

What is the expected Die size of Mendocino & Dixon using 0.25 um technology ? It would be large ?

Will these use C4 bump packaging.

regards,

HB