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Technology Stocks : Novellus -- Ignore unavailable to you. Want to Upgrade?


To: Jim Willie CB who wrote (1519)7/13/1998 10:57:00 AM
From: David Lawrence  Read Replies (1) | Respond to of 3813
 
Novellus Announces Copper Plating Technology Licensing Agreement With IBM

SAN FRANCISCO--(BUSINESS WIRE)--July 13, 1998--In a press conference today, Novellus Systems, Inc. announced they have signed a licensing agreement with IBM pertaining to certain criticaltechnologies needed to manufacture advanced integrated circuits (ICs) with copper interconnect structures.

The agreement is an outgrowth of a two-year joint development program between the two companies aimed at creating electroplating equipment needed for volume production of higher speed copper-based devices. Novellus has shipped copper plating systems to IBM to support its ramp of sub-0.25 micron copper manufacturing.

Under terms of the agreement, IBM is licensing its copper electroplating technology to Novellus for use in the company's new SABRE(TM) copper electrofill system, introduced last month as the centerpiece of Novellus' Damascus(TM) Complete Copper(TM) product suite. Combining Novellus' proprietary technology with that licensed from IBM, SABRE is a revolutionary new tool that enables production-worthy, void-free copper fill in extremely deep, narrow trenches.

More: biz.yahoo.com