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To: Ramsey Su who wrote (6359)	7/23/1998 11:49:00 AM
From: Clarksterh	Read Replies (2) \| Respond to of 10921

Ramsey - what benefit would copper provide for AMD, INTC, IBM etc., given the fact that the problem is on the supply vs the demand side. Product differentiation via speed and low power (less power wasted as heat). Over capacity does mean that producers won't want to add capacity, but it doesn't mean they will stop improving their product (at least until they run out of capital for improvements which isn't likely to happen for Intel in our lifetimes (although AMD and MU are another matter.)) Clark

To: Ramsey Su who wrote (6359)	7/23/1998 12:50:00 PM
From: Mason Barge	Read Replies (1) \| Respond to of 10921

<<if "book" drops to $50 next month and "bill" is $100, does it mean we will have a b-t-b of 2? At some point, reporters better start picking up the real $$ numbers.>> You inadvertantly switched book and bill, the btb would be .50. And no, there is a three-month buffer, that is, the btb is reported as a rolling average cumulative of the three preceding months. Yes, certainly, the "book" side is subject to pushouts, but the effect of pushouts on the btb has only been significant during periods of trend reversal. Your main point is well taken, I'm not trying to nit-pick but only to make sure I share whatever information I have. The situation is even less accurate than you are assuming, as the bookings and billings themselves are three-month trends. To get monthly numbers you have to calculate, as someone on this board showed me (whoever you are, you may take credit), using the equation (a+b+c) - (b+c+d). Your news about Korea is scary.

To: Ramsey Su who wrote (6359)	7/24/1998 7:21:00 PM
From: Grand Poobah	Read Replies (1) \| Respond to of 10921

I am still curious as to what benefit would copper provide for AMD, INTC, IBM etc., given the fact that the problem is on the supply vs the demand side. The speed advantage for a process using Cu interconnects and low-k dielectrics over Al and SiO2 goes something like this: 0.35-micron process: Cu is 1.2 times faster 0.25-micron process: Cu is 1.4 times faster 0.18-micron process: Cu is 2.0 times faster 0.13-micron process: Cu is 2.6 times faster I previously posted a little more about this over on the LSI Logic thread, if you are interested in more details: Message 4496392 Message 4497988 Regards, G.P.