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To: Dr. Evil who wrote (36592)7/28/1998 2:23:00 AM
From: Fabeyes  Respond to of 53903
 
----> One last thing to consider, not every mask layer requires deep UV technology in order to make a .21um part, bear that in mind when you start counting steppers.

That is very true; just the most critical levels require DUV. Also, since you brought it up, the DUV steppers are an emerging process and the through put of the non-DUV steppers will not be matched for quite sometime. It is a process involving keeping all production areas in sync; this will be the challenge. There is more than one fabrication area, and each will have its own steppers and own criteria.

----> When I say don't doubt MU's ability to ramp these parts, I'm speaking only of the Boise site. They have shown an impressive ability to ramp state of the art parts quickly.

I agree; they HAVE been impressive to ramp parts and processes quickly. However, never before have they been using DUV steppers. Along with the new isolation efforts being put forth this leaves a whole new can of worms. They have several things missing now from the past scenario -- the technical leadership that got them through the "tough" times. I am not saying they do not have the ability; just the leadership.

Feed your cat and enjoy,