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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Yousef who wrote (35201)	7/29/1998 4:37:00 PM
From: MikeyB	Respond to of 1572630

Yousef, Re: "I don't think you can jump to that conclusion ... unless ... you can justify it with cycle times of the two different processes. " Here's the process flow: Standard Al Process(1) .................... Copper Damascene Process(2) a)Dep Dielectric HDP Oxide ............. a)Dep Dielectic (SiO2/Si3N4/SiO2) b)Polish Dielectric ...............................b)Contact Lithography c)Contact Lithography .........................c)Etch Contacts & Strip Resist d)Etch Contacts & Strip Resist ..........d)Trench (Cu) Mask e)Dep Seed Layer IMP Ti/TiN ...........e)Etch Trench (Oxide) & Strip Resist f)Dep Tungsten ....................................f)Dep Seed Layer IMP Ta or TiN g)Polish Tungsten ...............................g)Dep/Electroplate Copper h)Dep Aluminum (Ti/AlCu/TiN)..........h)Polish Copper i)Aluminum Lithography j) Aluminum Etch & Resist Strip Cycle-time wise the following steps are approximately equivalent: 1a --> 2a 1c --> 2b 1d --> 2c 1e --> 2f 1g --> 2h 1i --> 2d That leaves: 1b ~2.5-3 hrs/lot 1f ~1 hr/lot 1h ~1-1.5hr/lot 1j ~2.5-3hr/lot ---------------- 7-8.5 hrs/lot and 2e ~1-1.5hr/lot 2g ~0.5-1hr/lot (remember this is a batch process of 2-4 lots at a time) ------------------ 1.5-2.5 hrs/lot So over the process cycle that comes out to a 30%-40% difference in cycle time. There's also the unquantified time that lots sit idle between steps waiting for processing. This probably increases the difference to 35%-45%. MikeyB