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To: Bill Hermesmann who wrote (18871)	7/31/1998 11:28:00 AM
From: Czechsinthemail	Respond to of 25960

Article on delays in implementing new chip technology, but contains this tidbit from Intel: "Initially, we thought we would implement 300mm technology with the .18 micron process technology," said Intel spokesman Howard High, referring to an advance that allows wires to be packed more tightly on a semiconductor. "But the .18 process is actually coming on line faster than we thought," he said, "so we have been planning to implement 300mm with the next-generation process technology, which should be in the 2001 or 2002 time frame." scmp.com Baird