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To: Jeff Fox who wrote (61778)	8/4/1998 2:54:00 PM
From: Paul Engel	Respond to of 186894

Jeff - Re: "1. What do you think of this "new" program of the IBM labs to use the popular press for technology announcements?" This is not a new phenomenon. IBM has been doing this for many, many years - Si Ge, Copper, Josephson Junctions (1970s), Piston-type Thermal Modules, Magnetic Bit density improvements, thin film head advances. Some of these technologies are actually close to production annd do get into production. Some just die a slow death. Re: "2. Could you give us your overview of RC characteristics and recent techniques to lower R's and C's?" Both are obviously desirable. Going to copper has many trade-offs and the damascene process (not the only type of copper process) is technically excellent but ultimately reduces the net benefit of the reduced RESISTIVITY of copper. Changing intermetal dielectrics - lowering the capacitance - may prove simpler in the short run. Paul