Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Kulicke and Soffa -- Ignore unavailable to you. Want to Upgrade?

To: thomas hayden who wrote (3032)	8/7/1998 2:20:00 PM
From: Ian@SI	Read Replies (1) \| Respond to of 5482

Missed this Press Release yesterday. Perhaps Flip Chip will start contributing black rather than red ink to the balance sheet... Semiconductors Story Flip Chip Technologies Announces Production of Devices for Mass Storage Applications August 7, 1998ÿÿÿÿÿÿ Source: PR Newswire -------------------------------------------------------------------------------- PHOENIX, Aug. 6 /PRNewswire/ via NewsEdge Corporation -- Flip Chip Technologies L.L.C. (FCT) announced today it is supplying its proprietary solder wafer bumping service to Texas Instruments' Storage Products Group, which is composed of Silicon Systems Inc. (SSI), Intersect Technologies and the mass storage unit of Texas Instruments. FCT is bumping the TI Storage Products' preamplifier devices for the Hard Disk Drive (HDD) market. In addition, several new devices for mass storage applications have been processed through FCT and are expected to go into production fourth quarter of 1998. As memory capacity and the data transfer rates of hard disk drives increase further, the signal-to-noise ratios become more critical. The traditional wire bonded solutions are giving way to a low inductance, high speed interconnect using flip chip on flex technology, which allows the pre-amplifier chip to be placed closer to the head assembly. "FCT is dedicated to addressing the needs of the HDD market by providing high volume bumping capacity, fast turnaround, high yields and high reliability," said Tom Leonard, FCT's Vice President of Marketing and Sales. "As speed within disk drives increase, more leaders in the HDD market are moving to flip chip use. We look to Texas Instruments Storage Products Group as a market leader." FCT received full qualification status with the Storage Products Group on May 5, 1998, based upon successful completion of all qualification plan requirements. These requirements included mechanical and physical integrity measurements, reliability stress tests, and FCT process control capability. "FCT has demonstrated responsiveness in addressing our solder bump service needs," said Ron Yovan, Senior Staff Quality Assurance Engineer for Texas Instruments Storage Products. "We look forward to continuing to leverage FCT's capabilities to provide HDD manufacturers the most advanced integrated circuit solutions available." Texas Instruments Storage Products is a leading designer and manufacturer of advanced semiconductors for mass storage applications, and is composed of Silicon Systems, Inc., Intersect Technologies, Inc., specific assets of Oasix & Arisix Corporations, and the mass storage semiconductor unit of Texas Instruments. Leveraging its digital signal processor (DSP) and analog and mixed-signal leadership, with industry-proven mass storage integrated circuits (ICs), Texas Instruments Storage Products provides total systems solutions to customers. Texas Instruments Storage Products ICs address the performance, capacity and cost demands of the storage market including manufacturers of hard disk drives, removable drives, and emerging mass storage technologies. Additional information is available through Texas Instruments Storage Products' website located at www.ti.com/storage. FCT is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry. A joint venture of Delphi Delco Electronics Systems and Kulicke & Soffa Industries, FCT is an ISO 9002 and QS 9000 certified company formed in 1996. FCT offers proven merchant bumping services used in applications requiring higher performance, reduced form factor and lower costs than those obtainable through traditional surface mount technologies. For more information, visit the FCT website located at www.flipchip.com. SOURCE Flip Chip Technologies L.L.C. /CONTACT: Tracy Schofield of Flip Chip Technologies, 602-431-6020 ext. 252/ /Web site: www.ti.com/ /Web site: www.flipchip.com/