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Technology Stocks : Atmel - the trend is about to change -- Ignore unavailable to you. Want to Upgrade?

To: Peter S. Maroulis who wrote (8741)	8/9/1998 12:54:00 PM
From: jerryrom	Read Replies (1) \| Respond to of 13565

techweb.com August 10, 1998, Issue: 1121 Section: Semiconductors Atmel aims new EEPROM at mobile-phone applications Atmel Corp. has unveiled a high-density memory chip the company is heralding as the next-generation serial EEPROM of choice for mobile-phone OEMs. With 512 Kbits of reprogrammable nonvolatile storage, the AT24C512 was developed to address demand for higher density in a smaller footprint with byte alterability, high endurance, and low power consumption, according to San Jose-based Atmel. The chip is being touted as a way to store frequently dialed numbers, the last number called, and other memory functions in next-generation cellular handsets, pagers, and PDAs. Its low-voltage operation and low power consumption also make the AT24C512 suitable for game cards, digital cameras, and other portable consumer products, according to Sudeep Balain, Atmel's director of marketing for serial EEPROMs. "This device now raises the bar in terms of industry performance, capability, and ease of use," Balain said. The AT24C512 adds further depth to an already broad portfolio of serial EEPROMs developed for two-wire and SPI (Serial Peripheral Interface) three- and four-wire protocols. The device is Atmel's densest EEPROM to date for the industry-standard I2C two-wire communication protocol. As of July, Atmel has shipped a total of 1 billion serial EEPROM chips and is seeing increasing interest for its two-wire products, Balain said. Internally organized as 65,546 8-bit words, the AT24C512 offers data-transfer rates up to 1 MHz at 5 or 2.7 V. Operation at 1.8 V is also possible, but at a reduced transfer rate of 400 KHz maximum. The chip is available in an eight-pin PDIP or 20-pin SOIC starting at $4.50 in 1,000s. Automotive-grade and extended-temperature versions are also available. An optional eight-pin, 5 x 8-mm leadless-array package enables existing 128- and 256-Kbit designs to migrate to higher densities without modifying the printed-circuit-board layout, Balain said. Copyright r 1998 CMP Media Inc.

To: Peter S. Maroulis who wrote (8741)	8/9/1998 5:33:00 PM
From: RAJ KULKARNI	Read Replies (1) \| Respond to of 13565

Actually, Atmel's situation is little different currently, The last thing Atmel or any semiconductor company needs in this world is another Fab. As far Atmel's Fab requirement goes, They have plenty of capacity in Europe, As a matter fact there most recent Fab 7 in Rousset,France is only doing 1,000 wafers a week, This Fab is Capable of ramping upto 7,500 wafers a week, Also they have more capacity available at Temic's Fab in Nantes, France. Atmel is closely working with its European telecom partners on a system on chip solution for mobile phone application, The last thing they would want to do is to get into fight with there customer, Over a Fab location. By the way Atmel's future fab is currently proposed to be built in Kulim Hi tech park,in Malaysia. That would be once the semiconductor market improves.